Hatano; Takaaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hatano; Takaaki.The latest application filed is for "copper alloy plate having excellent electrical conductivity and bending deflection coefficient".

Company Profile

0.8.13

Hatano; Takaaki - Kanagawa JP
Hatano; Takaaki - Koza-gun N/A JP
Hatano; Takaaki - Kanagawa-ken JP
Hatano, Takaaki - Kouza-gun JP
Hatano; Takaaki - Samukawa-machi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper alloy plate having excellent electrical conductivity and bending deflection coefficient Grant 11,021,774 - Hatano June 1, 2	2021-06-01
Camera module and titanium-copper foil Grant 9,575,286 - Hatano , et al. February 21, 2	2017-02-21
Copper Alloy Plate Having Excellent Electrical Conductivity And Bending Deflection Coefficient App 20160186296 - HATANO; TAKAAKI	2016-06-30
Camera Module And Titanium-copper Foil App 20150338603 - HATANO; Takaaki ; et al.	2015-11-26
Heat-resistant Sn-plated Cu-Zn alloy strip with suppressed whiskering Grant 8,524,376 - Hatano September 3, 2	2013-09-03
Sn-plated copper alloy strip having improved fatigue characteristics Grant 8,182,932 - Hatano May 22, 2	2012-05-22
Cu-Zn alloy strip superior in thermal peel resistance of Sn plating and Sn plating strip thereof Grant 7,972,709 - Hatano July 5, 2	2011-07-05
Cu-ni-si system alloy App 20100000637 - Hatano; Takaaki	2010-01-07
Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof App 20090239094 - Hatano; Takaaki	2009-09-24
Sn-Plated Cu-Ni-Si Alloy Strip App 20090176125 - Hatano; Takaaki	2009-07-09
Sn-Plated Copper Alloy Strip Having Improved Fatigue Characteristics App 20090130480 - Hatano; Takaaki	2009-05-21
Heat-Resistant Sn-Plated Cu-Zn Alloy Strip with Suppressed Whiskering App 20090092851 - Hatano; Takaaki	2009-04-09
Copper-titanium alloys excellent in strength, conductivity and bendability, and method for producing same App 20060011275 - Izumi; Chihiro ; et al.	2006-01-19
Titanium-copper alloy having excellent conductivity and method of producing the same App 20050252589 - Izumi, Chihiro ; et al.	2005-11-17
Strip material used for shadow mask having improved post-etching shape App 20040261911 - Kondo, Yuko ; et al.	2004-12-30
Method of manufacturing rolled copper foil for flexible printed circuit Grant 6,689,235 - Hatano , et al. February 10, 2	2004-02-10
Titanium copper alloy having excellent strength and bendability, and manufacturing method thereof App 20040003878 - Izumi, Chihiro ; et al.	2004-01-08
Method of manufacturing rolled copper foil for flexible printed circuit App 20020139459 - Hatano, Takaaki ; et al.	2002-10-03
Fe-Ni alloy shadow mask blank with excellent etch perforation properties and method for manufacturing the same App 20010047839 - Hatano, Takaaki ; et al.	2001-12-06
Rolled copper foil for flexible printed circuit and method of manufacturing the same Grant 6,197,433 - Hatano March 6, 2	2001-03-06

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