| Patent | Date |
|---|
Liquid-cooled electronic device
Grant 5,959,351 - Sasaki , et al. September 28, 1 | 1999-09-28 |
Air-cooled electronic apparatus with condensation prevention
Grant 5,934,368 - Tanaka , et al. August 10, 1 | 1999-08-10 |
Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels
Grant 5,796,580 - Komatsu , et al. August 18, 1 | 1998-08-18 |
Low thermal resistant, fluid-cooled semiconductor module
Grant 5,774,334 - Kawamura , et al. June 30, 1 | 1998-06-30 |
Cooling unit for electronic equipment
Grant 5,764,483 - Ohashi , et al. June 9, 1 | 1998-06-09 |
Semiconductor module
Grant 5,705,850 - Ashiwake , et al. January 6, 1 | 1998-01-06 |
Electronic equipment and lap-top type electronic equipment
Grant 5,646,824 - Ohashi , et al. July 8, 1 | 1997-07-08 |
Electronic apparatus
Grant 5,592,363 - Atarashi , et al. January 7, 1 | 1997-01-07 |
Forced air cooling apparatus having blower and air current regulating plate that reduces eddy air current at inlet of blower
Grant 5,558,493 - Hayashi , et al. September 24, 1 | 1996-09-24 |
Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards
Grant 5,504,924 - Ohashi , et al. April 2, 1 | 1996-04-02 |
Cooling device for semiconductor packages, having flexible film heat expulsion means
Grant 5,488,255 - Sato , et al. January 30, 1 | 1996-01-30 |
Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
Grant 5,428,503 - Matsushima , et al. June 27, 1 | 1995-06-27 |
Apparatus for cooling semiconductor device and computer having the same
Grant 5,406,807 - Ashiwake , et al. April 18, 1 | 1995-04-18 |
Cooling apparatus of electronic device
Grant 5,365,402 - Hatada , et al. November 15, 1 | 1994-11-15 |
Cooling apparatus of electronic equipment
Grant 5,361,188 - Kondou , et al. November 1, 1 | 1994-11-01 |
LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
Grant 5,358,032 - Arai , et al. October 25, 1 | 1994-10-25 |
Semiconductor apparatus of module installing type
Grant 5,315,482 - Tanaka , et al. May 24, 1 | 1994-05-24 |
Packaging structure of small-sized computer
Grant 5,313,362 - Hatada , et al. May 17, 1 | 1994-05-17 |
Liquid impingement cooling module for semiconductor devices
Grant 5,270,572 - Nakajima , et al. December 14, 1 | 1993-12-14 |
LSI cooling apparatus and computer cooling apparatus
Grant 5,195,576 - Hatada , et al. March 23, 1 | 1993-03-23 |
Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
Grant 5,077,601 - Hatada , et al. December 31, 1 | 1991-12-31 |
Heat exchanger coated with aqueous coating composition
Grant 4,503,907 - Tanaka , et al. March 12, 1 | 1985-03-12 |
Expansion valve
Grant 4,500,035 - Kuroda , et al. February 19, 1 | 1985-02-19 |
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