| Patent | Date |
|---|
Semiconductor device
Grant 6,953,991 - Hatada , et al. October 11, 2 | 2005-10-11 |
Lighting apparatus with enhanced capability of removing heat
Grant 6,917,143 - Matsui , et al. July 12, 2 | 2005-07-12 |
Lighting apparatus whose light emitting elements are hard to be taken off
Grant 6,883,933 - Matsui , et al. April 26, 2 | 2005-04-26 |
Semiconductor device
App 20040251536 - Hatada, Kenzo ; et al. | 2004-12-16 |
Lighting apparatus whose light emitting elements are hard to be taken off
App 20030052594 - Matsui, Nobuyuki ; et al. | 2003-03-20 |
Lighting apparatus with enhanced capability of removing heat
App 20030052584 - Matsui, Nobuyuki ; et al. | 2003-03-20 |
Semiconductor chip and method manufacturing the same
Grant 6,492,255 - Enomoto , et al. December 10, 2 | 2002-12-10 |
Semiconductor chip and method manufacturing the same
App 20010049187 - Enomoto, Ryo ; et al. | 2001-12-06 |
Semiconductor device having a lead clamping arrangement
Grant 5,998,866 - Ochi , et al. December 7, 1 | 1999-12-07 |
Optical module having a vertical-cavity surface-emitting laser
Grant 5,796,714 - Chino , et al. August 18, 1 | 1998-08-18 |
Semiconductor device and method of producing said semiconductor device
Grant 5,783,463 - Takehashi , et al. July 21, 1 | 1998-07-21 |
Process for bonding a semiconductor to a circuit substrate including a solder bump transferring step
Grant 5,739,053 - Kawakita , et al. April 14, 1 | 1998-04-14 |
Semiconductor device and method of producing said semiconductor device
Grant 5,640,044 - Takehashi , et al. June 17, 1 | 1997-06-17 |
Bump electrode for connecting electronic components
Grant 5,477,087 - Kawakita , et al. December 19, 1 | 1995-12-19 |
Electronic components mounting/connecting package and its fabrication method
Grant 5,336,547 - Kawakita , et al. August 9, 1 | 1994-08-09 |
Method for bonding lead with electrode of electronic device
Grant 5,316,204 - Takehashi , et al. May 31, 1 | 1994-05-31 |
Reduced diameter camera head for solid-state image pickup device and method of producing same
Grant 5,233,426 - Suzuki , et al. August 3, 1 | 1993-08-03 |
Device for testing semiconductor integrated circuits and method of testing the same
Grant 5,089,772 - Hatada , et al. February 18, 1 | 1992-02-18 |
Lead connection structure
Grant 5,089,750 - Hatada , et al. * February 18, 1 | 1992-02-18 |
Stack type semiconductor package
Grant 4,996,583 - Hatada February 26, 1 | 1991-02-26 |
Lead connection structure
Grant 4,959,590 - Hatada , et al. September 25, 1 | 1990-09-25 |
Bonding method
Grant 4,876,221 - Hatada October 24, 1 | 1989-10-24 |
Method of joining beam leads with projections to device electrodes
Grant 4,784,972 - Hatada November 15, 1 | 1988-11-15 |
Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted
Grant 4,766,426 - Hatada , et al. August 23, 1 | 1988-08-23 |
Method of connecting a semiconductor device to a wiring board
Grant 4,749,120 - Hatada June 7, 1 | 1988-06-07 |
Method of bonding semiconductor devices together
Grant 4,693,770 - Hatada September 15, 1 | 1987-09-15 |
Electrode connection structure of flat device
Grant 4,684,974 - Matsunaga , et al. August 4, 1 | 1987-08-04 |
Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
Grant 4,494,688 - Hatada , et al. January 22, 1 | 1985-01-22 |
Method of making metal electrode of semiconductor device
Grant 4,293,637 - Hatada , et al. October 6, 1 | 1981-10-06 |
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