Hata; William Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hata; William Y..The latest application filed is for "heat pipe in overmolded flip chip package".

Company Profile

0.15.5

Hata; William Y. - Saratoga CA
Hata; William Y. - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bond and probe pad distribution Grant 9,267,985 - Hata February 23, 2	2016-02-23
Heat pipe in overmolded flip chip package Grant 9,202,772 - Hata December 1, 2	2015-12-01
Heat Spreading In Molded Semiconductor Packages App 20140239483 - Hata; William Y.	2014-08-28
Heat Pipe In Overmolded Flip Chip Package App 20140239487 - Hata; William Y.	2014-08-28
Integrated circuit package architecture Grant 8,772,085 - Hata July 8, 2	2014-07-08
Integrated Circuit Package Architecture App 20120159779 - Hata; William Y.	2012-06-28
Integrated circuit package architecture Grant 8,148,813 - Hata April 3, 2	2012-04-03
Reticle for wafer test structure areas Grant 8,003,984 - Hata August 23, 2	2011-08-23
Package Architecture App 20110024889 - Hata; William Y.	2011-02-03
Bond And Probe Pad Distribution App 20110025359 - Hata; William Y.	2011-02-03
Reticle for layout modification of wafer test structure areas Grant 7,316,935 - Hata January 8, 2	2008-01-08
Method and apparatus for monitoring yield of integrated circuits Grant 7,212,032 - Dastidar , et al. May 1, 2	2007-05-01
Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runaway Grant 6,982,566 - Alam , et al. January 3, 2	2006-01-03
Techniques for reticle layout to modify wafer test structure area Grant 6,967,111 - Hata November 22, 2	2005-11-22
Underfill for maximum flip chip package reliability Grant 6,956,165 - Hata , et al. October 18, 2	2005-10-18
Catalytic acceleration and electrical bias control of CMP processing Grant 5,948,697 - Hata September 7, 1	1999-09-07
Method of producing stepped wall interconnects and gates Grant 5,880,015 - Hata March 9, 1	1999-03-09
Method of producing submicron contacts with unique etched slopes Grant 5,366,848 - Thane , et al. November 22, 1	1994-11-22

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