HASHIZUME; Kayo

Patent Applications and Registrations

Patent applications and USPTO patent grants for HASHIZUME; Kayo.The latest application filed is for "base material for printed circuit board and printed circuit board".

Company Profile

8.4.8

HASHIZUME; Kayo - Osaka JP
HASHIZUME; Kayo - Osaka-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Base Material For Printed Circuit Board And Printed Circuit Board App 20210127487 - AIKAWA; Kenichiro ; et al.	2021-04-29
Base Material For Printed Circuit Board And Method Of Manufacturing Base Material For Printed Circuit Board App 20210014978 - HASHIZUME; Kayo ; et al.	2021-01-14
Resin film, substrate for printed wiring board, and printed wiring board Grant 10,889,086 - Hashizume , et al. January 12, 2	2021-01-12
Substrate For Printed Circuit Board, Printed Circuit Board, Method Of Manufacturing Substrate For Printed Circuit Board, And Copper Nano-ink App 20210007227 - MIYATA; Kazuhiro ; et al.	2021-01-07
Resin Film, Substrate For Printed Wiring Board, And Printed Wiring Board App 20200376810 - HASHIZUME; Kayo ; et al.	2020-12-03
Substrate for printed circuit board and printed circuit board Grant 10,596,782 - Hashizume , et al.	2020-03-24
Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material Grant 10,244,627 - Hashizume , et al.	2019-03-26
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board Grant 10,225,931 - Hashizume , et al.	2019-03-05
Base Film For Printed Circuit Board, Substrate For Printed Circuit Board, And Method For Manufacturing Substrate For Printed Circuit Board App 20180371191 - HASHIZUME; Kayo ; et al.	2018-12-27
Substrate For Printed Circuit Board And Printed Circuit Board App 20180147815 - HASHIZUME; Kayo ; et al.	2018-05-31
Substrate For Printed Circuit Board, Printed Circuit Board, And Method For Producing Substrate For Printed Circuit Board App 20180124925 - HASHIZUME; Kayo ; et al.	2018-05-03
Substrate For Printed Wiring Board And Method For Producing The Same, Printed Wiring Board And Method For Producing The Same, And Resin Base Material App 20170347464 - HASHIZUME; Kayo ; et al.	2017-11-30

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