Hashino; Eiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hashino; Eiji.The latest application filed is for "interconnector for solar cells, and solar cell module".

Company Profile

0.10.17

Hashino; Eiji - Tokyo JP
Hashino; Eiji - Futtsu JP
Hashino; Eiji - Chiba JP
Hashino; Eiji - Futtsu-Shi JP
Hashino; Eiji - Kawasaki JP
Hashino, Eiji - Chiba-Ken JP
HASHINO, EIJI - KANAGAWA JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead-free solder bump bonding structure Grant 8,847,390 - Hashino , et al. September 30, 2	2014-09-30
Interconnector For Solar Cells, And Solar Cell Module App 20140109962 - Kobayashi; Takayuki ; et al.	2014-04-24
Lead-free Solder Bump Bonding Structure App 20140054766 - HASHINO; Eiji ; et al.	2014-02-27
Solder ball mounting method and apparatus Grant 8,104,663 - Ishikawa , et al. January 31, 2	2012-01-31
Micro-ball Removal Method And Removal Device, And Micro-ball Collective Mounting Method And Collective Mounting Apparatus App 20110107580 - Ishikawa; Shinji ; et al.	2011-05-12
Solder Ball Mounting Method And Apparatus App 20100127049 - Ishikawa; Shinji ; et al.	2010-05-27
CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner Grant 7,465,217 - Kinoshita , et al. December 16, 2	2008-12-16
Ball transferring method and apparatus App 20080032495 - Shimokawa; Kenji ; et al.	2008-02-07
Ball transferring method and apparatus Grant 7,285,486 - Shimokawa , et al. October 23, 2	2007-10-23
CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner App 20060160477 - Kinoshita; Toshiya ; et al.	2006-07-20
Semiconductor device provided with low melting point metal bumps Grant 7,045,388 - Tatsumi , et al. May 16, 2	2006-05-16
Method for fabricating a semiconductor devices provided with low melting point metal bumps Grant 7,045,389 - Tatsumi , et al. May 16, 2	2006-05-16
Ball transferring method and apparatus App 20050176176 - Shimokawa, Kenji ; et al.	2005-08-11
Ball transferring method and apparatus Grant 6,916,731 - Shimokawa , et al. July 12, 2	2005-07-12
Spherical semiconductor device and method for fabricating the same Grant 6,909,182 - Tatsumi , et al. June 21, 2	2005-06-21
Method of partially plating substrate for electronic devices Grant 6,884,708 - Tatsumi , et al. April 26, 2	2005-04-26
Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner App 20040072510 - Kinoshita, Toshiya ; et al.	2004-04-15
Spherical Semiconductor Device And Method For Fabricating The Same App 20040061224 - Tatsumi, Kohei ; et al.	2004-04-01
Spherical semiconductor device and method for fabricating the same App 20030020164 - Tatsumi, Kohei ; et al.	2003-01-30
Ball transferring method and apparatus App 20020137324 - Shimokawa, Kenji ; et al.	2002-09-26
Spherical semiconductor device and method for fabricating the same App 20020132462 - Tatsumi, Kohei ; et al.	2002-09-19
Semiconductor Device Provided With Low Melting Point Metal Bumps App 20020036344 - TATSUMI, KOHEI ; et al.	2002-03-28
Spherical Semiconductor Device And Method For Fabricating The Same App 20020011665 - TATSUMI, KOHEI ; et al.	2002-01-31
Method Of Partially Plating Substrate For Electronic Devices App 20010012683 - TATSUMI, KOHEI ; et al.	2001-08-09

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