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Patent applications and USPTO patent grants for Hashimoto; Shu.The latest application filed is for "adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element".
Patent | Date |
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Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element Grant 10,358,580 - Ikeda , et al. July 23, 2 | 2019-07-23 |
Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element Grant 9,868,884 - Ikeda , et al. January 16, 2 | 2018-01-16 |
Adhesive Composition, Resin Cured Product Obtained From Adhesive Composition, Method For Manufacturing Semiconductor Device Using Adhesive Composition, And Solid-state Imaging Element App 20160340554 - IKEDA; Aya ;   et al. | 2016-11-24 |
Adhesive Composition, Method For Manufacturing Semiconductor Device Using Adhesive Composition, And Solid-state Imaging Element App 20160340561 - Ikeda; Aya ;   et al. | 2016-11-24 |
Hood inner panel Grant 8,740,291 - Hashimoto , et al. June 3, 2 | 2014-06-03 |
Hood Inner Panel App 20130175827 - Hashimoto; Shu ;   et al. | 2013-07-11 |
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