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Patent applications and USPTO patent grants for Hashimoto; Munenori.The latest application filed is for "solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate".
Patent | Date |
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Solder layer and device bonding substrate using the same and method for manufacturing such a substrate Grant 8,747,579 - Oshika , et al. June 10, 2 | 2014-06-10 |
Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate Grant 8,516,692 - Oshika , et al. August 27, 2 | 2013-08-27 |
Solder Layer, Substrate For Device Joining Utilizing The Same And Method Of Manufacturing The Substrate App 20090095513 - Oshika; Yoshikazu ;   et al. | 2009-04-16 |
Solder Layer And Device Bonding Substrate Using The Same And Method For Manufacturing Such A Substrate App 20080205013 - OSHIKA; Yoshikazu ;   et al. | 2008-08-28 |
Solder Layer And Electronic Device Bonding Substrate And Submount Using The Same App 20070228105 - Oshika; Yoshikazu ;   et al. | 2007-10-04 |
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