loadpatents
name:-0.045615911483765
name:-0.034436941146851
name:-0.0095620155334473
Hashimoto; Keiichi Patent Filings

Hashimoto; Keiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hashimoto; Keiichi.The latest application filed is for "heat-transfer roller for sputtering and method of making the same".

Company Profile
7.25.33
  • Hashimoto; Keiichi - Tochigi JP
  • HASHIMOTO; Keiichi - Kamakura-shi JP
  • Hashimoto; Keiichi - Nikko JP
  • Hashimoto; Keiichi - Utsunomiya JP
  • Hashimoto; Keiichi - Kamakura JP
  • Hashimoto; Keiichi - Kanuma JP
  • HASHIMOTO; Keiichi - Kanuma-shi Tochigi
  • HASHIMOTO; Keiichi - Utsunomiya-shi JP
  • HASHIMOTO; Keiichi - Nikko-shi Tochigi
  • HASHIMOTO; Keiichi - Kanagawa JP
  • Hashimoto; Keiichi - Tokyo JP
  • Hashimoto; Keiichi - Miyagi JP
  • Hashimoto; Keiichi - Yokohama JP
  • Hashimoto, Keiichi - Tochigi-ken JP
  • HASHIMOTO, KEIICHI - YOKKAICHI JP
  • Hashimoto; Keiichi - Minato-ku Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Seat core material
Grant 11,224,292 - Hashimoto , et al. January 18, 2
2022-01-18
Seat core material
Grant 11,052,800 - Takayama , et al. July 6, 2
2021-07-06
Heat-Transfer Roller for Sputtering and Method of Making the Same
App 20210050196 - IWATA; Hiroshi ;   et al.
2021-02-18
Method for producing seat core material, and seat core material
Grant 10,893,750 - Takayama , et al. January 19, 2
2021-01-19
Seat core material
Grant 10,807,507 - Hashimoto , et al. October 20, 2
2020-10-20
Heat-transfer Roller For Sputtering And Method Of Making The Same
App 20200303173 - IWATA; Hiroshi ;   et al.
2020-09-24
Seat Core Material
App 20200238870 - TAKAYAMA; Atsuo ;   et al.
2020-07-30
Vehicle seat core member
Grant 10,717,370 - Hisamatsu , et al.
2020-07-21
Sputtering cathode, sputtering device, and method for producing film-formed body
Grant 10,692,708 - Iwata , et al.
2020-06-23
Core material of vehicular seat cushion
Grant 10,631,650 - Hashimoto , et al.
2020-04-28
Seat Core Material
App 20200001760 - HASHIMOTO; Keiichi ;   et al.
2020-01-02
Core Material Of Vehicular Seat Cushion
App 20200000235 - HASHIMOTO; Keiichi ;   et al.
2020-01-02
Seat Core Material
App 20190350365 - HASHIMOTO; Keiichi ;   et al.
2019-11-21
Composite seat core material and vehicular seat element using the composite seat core material
Grant 10,391,911 - Takayama , et al. A
2019-08-27
Sputtering Cathode, Sputtering Device, and Method for Producing Film-Formed Body
App 20190203346 - IWATA; Hiroshi ;   et al.
2019-07-04
Seat core member, seat portion, and seat
Grant 10,195,966 - Ueguri , et al. Fe
2019-02-05
Vehicle Seat Core Member
App 20190014907 - HISAMATSU; Katsunori ;   et al.
2019-01-17
Method For Producing Seat Core Material, And Seat Core Material
App 20180368578 - TAKAYAMA; Atsuo ;   et al.
2018-12-27
Composite Seat Core Material And Vehicular Seat Element Using The Composite Seat Core Material
App 20180319304 - TAKAYAMA; Atsuo ;   et al.
2018-11-08
Sputtering Cathode, Sputtering Device, And Method For Producing Film-formed Body
App 20180171464 - IWATA; Hiroshi ;   et al.
2018-06-21
Seat Core Member, Seat Portion, And Seat
App 20180079328 - UEGURI; Motoaki ;   et al.
2018-03-22
Method for manufacturing vehicle seat core member and vehicle seat core member
Grant 9,902,098 - Takayama , et al. February 27, 2
2018-02-27
Method For Manufacturing Vehicle Seat Core Member And Vehicle Seat Core Member
App 20170252952 - TAKAYAMA; Atsuo ;   et al.
2017-09-07
Chip-size-package semiconductor chip and manufacturing method
Grant 8,119,453 - Hashimoto February 21, 2
2012-02-21
Chip-size-package semiconductor chip and manufacturing method
App 20100248425 - Hashimoto; Keiichi
2010-09-30
Forming method of silicide film
Grant 7,781,337 - Hashimoto August 24, 2
2010-08-24
Semiconductor memory devices with charge traps
Grant 7,602,012 - Hashimoto October 13, 2
2009-10-13
Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads
Grant 7,560,498 - Sasaki , et al. July 14, 2
2009-07-14
Semiconductor memory and method of writing data into the semiconductor memory
Grant 7,554,833 - Hashimoto June 30, 2
2009-06-30
Process of producing foamed molding from expanded polypropylene resin beads
Grant 7,531,116 - Sasaki , et al. May 12, 2
2009-05-12
Semiconductor memory device with charge traps
App 20080251835 - Hashimoto; Keiichi
2008-10-16
Semiconductor memory and method of writing data into the semiconductor memory
App 20080144359 - Hashimoto; Keiichi
2008-06-19
Method of manufacturing semiconductor device
Grant 7,323,384 - Hashimoto January 29, 2
2008-01-29
Foamed molding of expanded polypropylene resin beads
App 20070197673 - Hashimoto; Keiichi ;   et al.
2007-08-23
Expanded polypropylene resin beads and process for the production thereof
Grant 7,259,189 - Hashimoto , et al. August 21, 2
2007-08-21
Shock absorbing material and vehicle bumper
App 20070145755 - Shioya; Satoru ;   et al.
2007-06-28
Forming method of silicide film
App 20070105371 - Hashimoto; Keiichi
2007-05-10
Composite foamed polypropylene resin molding and method of producing same
Grant 7,182,896 - Hira , et al. February 27, 2
2007-02-27
Forming method of silicide film
Grant 7,176,134 - Hashimoto February 13, 2
2007-02-13
Composite foamed polypropylene resin molding and method of producing same
App 20070026218 - Hira; Akinobu ;   et al.
2007-02-01
Method Of Manufacturing Semiconductor Device
App 20060194388 - HASHIMOTO; Keiichi
2006-08-31
Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads
App 20060116434 - Sasaki; Hidehiro ;   et al.
2006-06-01
Expanded polypropylene resin bead and process of producing same
Grant 6,956,067 - Sasaki , et al. October 18, 2
2005-10-18
Composite foamed polypropylene resin molding and method of producing same
App 20050056957 - Hira, Akinobu ;   et al.
2005-03-17
Method of fabricating a semiconductor integrated circuit including a capacitor formed on a single insulating substrate layer having lower boron dose in the vicinity of the surface thereof
Grant 6,849,497 - Hashimoto February 1, 2
2005-02-01
Production method of foamed polypropylene resin beads
Grant 6,838,488 - Sasaki , et al. January 4, 2
2005-01-04
Process of producing foamed molding from expanded polypropylene resin beads and process of producing expanded polypropylene resin beads
App 20040256757 - Sasaki, Hidehiro ;   et al.
2004-12-23
Forming method of silicide film
App 20040259350 - Hashimoto, Keiichi
2004-12-23
Expanded polypropylene resin beads and process for the production thereof
App 20040254254 - Hashimoto, Keiichi ;   et al.
2004-12-16
Method of fabricating a semiconductor integrated circuit
App 20040102011 - Hashimoto, Keiichi
2004-05-27
Method for manufacturing capacitor structure, and method for manufacturing capacitor element
Grant 6,703,285 - Arakawa , et al. March 9, 2
2004-03-09
Method for manufacturing capacitor structure, and method for manufacturing capacitor element
App 20030219955 - Arakawa, Yoshikazu ;   et al.
2003-11-27
Expanded polypropylene resin bead and process of producing same
App 20030162012 - Sasaki, Hidehiro ;   et al.
2003-08-28
Expanded polypropylene resin bead and process of producing same
App 20030124335 - Sasaki, Hidehiro ;   et al.
2003-07-03
Forming method of silicide film
App 20030124843 - Hashimoto, Keiichi
2003-07-03
Production method of foamed polypropylene resin beads
App 20030034580 - Sasaki, Hidehiro ;   et al.
2003-02-20
Process For The Dimerization Of Lower Olefins
App 20010051758 - FUKUDA, YUKITOSHI ;   et al.
2001-12-13
Portable electric-plating gun
Grant D257,553 - Hashimoto November 25, 1
1980-11-25

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