loadpatents
Patent applications and USPTO patent grants for Hasegawa; Miki.The latest application filed is for "dielectric sheet".
Patent | Date |
---|---|
Dielectric sheet Grant 7,841,862 - Hasegawa November 30, 2 | 2010-11-30 |
Dielectric sheet App 20090078449 - Hasegawa; Miki | 2009-03-26 |
Anisotropic conductive sheet and its manufacturing method Grant 7,465,491 - Hasegawa , et al. December 16, 2 | 2008-12-16 |
Process for Producing Rigid Polyurethane Foam App 20080064778 - Hasegawa; Miki ;   et al. | 2008-03-13 |
Anisotropic conductive sheet and manufacture thereof Grant 7,304,390 - Hasegawa December 4, 2 | 2007-12-04 |
Anisotropic conductive sheet Grant 7,264,482 - Hasegawa September 4, 2 | 2007-09-04 |
Anisotropic conductive sheet and its manufacturing method Grant 7,244,127 - Hasegawa July 17, 2 | 2007-07-17 |
Anisotropic conductive sheet App 20060162287 - Hasegawa; Miki | 2006-07-27 |
Anisotropic conductive sheet and its manufacturing method App 20050233620 - Hasegawa, Miki | 2005-10-20 |
Flexible good conductive layer and anisotropic conductive sheet comprising same App 20050224762 - Hasegawa, Miki | 2005-10-13 |
Anisotropically conductive block and its manufacturing method App 20050221645 - Hasegawa, Miki | 2005-10-06 |
Anisotropic conductive sheet App 20050201034 - Hasegawa, Miki | 2005-09-15 |
Anisotropic conductive sheet and manufacture thereof App 20050194697 - Hasegawa, Miki | 2005-09-08 |
Anisotropic conductive sheet and its manufacturing method App 20050173731 - Hasegawa, Miki | 2005-08-11 |
Anisotropic conductive sheet and its manufacturing method App 20050145974 - Hasegawa, Miki ;   et al. | 2005-07-07 |
Fiber product-treating agents Grant 6,660,044 - Igarashi , et al. December 9, 2 | 2003-12-09 |
Fiber product-treating agents App 20010037529 - Igarashi, Takako ;   et al. | 2001-11-08 |
Process for making a tantalum capacitor chip Grant 5,667,536 - Hasegawa September 16, 1 | 1997-09-16 |
Package-type solid electrolytic capacitor Grant 5,638,253 - Hasegawa June 10, 1 | 1997-06-10 |
Fuse arrangement and capacitor containing a fuse Grant 5,586,014 - Hasegawa December 17, 1 | 1996-12-17 |
Packaging device and its manufacturing method Grant 5,554,823 - Hasegawa September 10, 1 | 1996-09-10 |
Method of forming a ball end for a solder wire Grant 5,538,176 - Hasegawa , et al. July 23, 1 | 1996-07-23 |
Resin-packaged electronic component Grant 5,466,887 - Hasegawa November 14, 1 | 1995-11-14 |
Resin-packaged electronic component having bent lead terminals Grant 5,451,716 - Hasegawa , et al. September 19, 1 | 1995-09-19 |
Process for producing solid electrolytic capacitors Grant 5,075,940 - Kuriyama , et al. December 31, 1 | 1991-12-31 |
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