Hasegawa; Hidenori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hasegawa; Hidenori.The latest application filed is for "current sensor".

Company Profile

1.13.9

Hasegawa; Hidenori - Tokyo JP
Hasegawa; Hidenori - Miyazaki N/A JP
Hasegawa; Hidenori - Kitakyushu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Current sensor Grant 10,247,759 - Suzuki , et al.	2019-04-02
Current Sensor App 20160223594 - Suzuki; Kenji ; et al.	2016-08-04
Semiconductor device having double side electrode structure Grant 8,643,161 - Hasegawa February 4, 2	2014-02-04
Semiconductor device Grant 8,482,113 - Hasegawa July 9, 2	2013-07-09
Semiconductor device having double side electrode structure and method of producing the same Grant 8,053,275 - Hasegawa November 8, 2	2011-11-08
Semiconductor Device App 20110260334 - HASEGAWA; Hidenori	2011-10-27
Semiconductor device and method of fabricating the semiconductor device Grant 7,911,047 - Hasegawa , et al. March 22, 2	2011-03-22
Semiconductor device and method of producing the same App 20090020882 - Hasegawa; Hidenori	2009-01-22
Semiconductor device and method of manufacturing thereof App 20080265412 - Hasegawa; Hidenori	2008-10-30
Semiconductor device and method of fabricating the semiconductor device App 20080265395 - Hasegawa; Hidenori ; et al.	2008-10-30
Semiconductor device with stacked chips Grant 7,247,949 - Hasegawa July 24, 2	2007-07-24
Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof Grant 7,172,924 - Hasegawa February 6, 2	2007-02-06
Method of manufacturing semiconductor device App 20050121773 - Hasegawa, Hidenori	2005-06-09
Semiconductor device and fabrication method thereof App 20050098859 - Hasegawa, Hidenori	2005-05-12
Method of manufacturing a stacked semiconductor device Grant 6,852,570 - Hasegawa February 8, 2	2005-02-08
Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device Grant 6,822,322 - Hasegawa November 23, 2	2004-11-23
Encoder Grant 6,750,445 - Sakai , et al. June 15, 2	2004-06-15
Method of manufacturing semiconductor device App 20040009647 - Hasegawa, Hidenori	2004-01-15
Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device Grant 6,630,368 - Hasegawa October 7, 2	2003-10-07
Substrate for mounting a semiconductor chip and method for manufacturing a semiconductor device App 20010026005 - Hasegawa, Hidenori	2001-10-04

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