loadpatents
name:-0.0083348751068115
name:-0.0064389705657959
name:-0.00085711479187012
Hasegawa; Chihiro Patent Filings

Hasegawa; Chihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hasegawa; Chihiro.The latest application filed is for "tris(dialkylamide)aluminum compound, and method for producing aluminum-containing thin film using same".

Company Profile
0.5.5
  • Hasegawa; Chihiro - Ube JP
  • Hasegawa; Chihiro - Ube-shi JP
  • Hasegawa; Chihiro - Yamaguchi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tris(dialkylamide)aluminum compound, and method for producing aluminum-containing thin film using same
Grant 9,194,041 - Shirai , et al. November 24, 2
2015-11-24
Tris(dialkylamide)aluminum Compound, And Method For Producing Aluminum-containing Thin Film Using Same
App 20140295084 - Shirai; Masashi ;   et al.
2014-10-02
Organoruthenium complex, and method for production of ruthenium thin film using the ruthenium complex
Grant 8,304,567 - Kadota , et al. November 6, 2
2012-11-06
Method for manufacturing semiconductor device
Grant 8,183,153 - Zama , et al. May 22, 2
2012-05-22
Method For Manufacturing Semiconductor Device
App 20100317189 - Zama; Hideaki ;   et al.
2010-12-16
Organoruthenium Complex, And Method For Production Of Ruthenium Thin Film Using The Ruthenium Complex
App 20100055313 - Kadota; Takumi ;   et al.
2010-03-04
Metal complex compound comprising .beta.-diketonato ligand
Grant 7,595,414 - Kadota , et al. September 29, 2
2009-09-29
Metal Complex Compound Comprising B-Diketonato Ligand
App 20080254216 - Kadota; Takumi ;   et al.
2008-10-16
Copper complexes and process for formation of copper-containing thin films by using the same
Grant 6,992,200 - Kadota , et al. January 31, 2
2006-01-31
Copper complexes and process for formatiom of copper-containing thin films by using the same
App 20050080282 - Kadota, Takumi ;   et al.
2005-04-14

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