Hasebe; Hajime
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hasebe; Hajime.The latest application filed is for "semiconductor device".
Company Profile
4.23.20
- Hasebe; Hajime - Hakodate JP
- - Hakodate JP
- Hasebe; Hajime - Nanae N/A JP
- Hasebe; Hajime - Hokkaido JP
- Hasebe; Hajime - Hokkaldo JP
- Hasebe, Hajime - Hakodale JP
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor device Grant 10,490,486 - Hasebe , et al. Nov | 2019-11-26 |
| Semiconductor Device App 20190027427 - HASEBE; Hajime ; et al. | 2019-01-24 |
| Semiconductor device Grant 10,115,658 - Hasebe , et al. October 30, 2 | 2018-10-30 |
| Semiconductor Device App 20170033033 - HASEBE; Hajime ; et al. | 2017-02-02 |
| Semiconductor device Grant 9,496,204 - Hasebe , et al. November 15, 2 | 2016-11-15 |
| Semiconductor Device App 20140084440 - HASEBE; Hajime ; et al. | 2014-03-27 |
| Semiconductor device Grant 08618642 - | 2013-12-31 |
| Semiconductor device Grant 8,618,642 - Hasebe , et al. December 31, 2 | 2013-12-31 |
| Semiconductor device Grant 8,581,396 - Hasebe , et al. November 12, 2 | 2013-11-12 |
| Semiconductor device and manufacturing method of the same Grant 8,558,362 - Amano , et al. October 15, 2 | 2013-10-15 |
| Method of manufacturing a semiconductor device Grant 8,102,035 - Amano , et al. January 24, 2 | 2012-01-24 |
| Semiconductor Device App 20120007224 - HASEBE; Hajime ; et al. | 2012-01-12 |
| Semiconductor Device App 20120007225 - HASEBE; Hajime ; et al. | 2012-01-12 |
| Semiconductor device Grant 8,044,509 - Hasebe , et al. October 25, 2 | 2011-10-25 |
| Method Of Manufacturing A Semiconductor Device App 20110186976 - Amano; Kenji ; et al. | 2011-08-04 |
| Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion Grant 7,948,068 - Amano , et al. May 24, 2 | 2011-05-24 |
| Semiconductor Device App 20110095412 - HASEBE; Hajime ; et al. | 2011-04-28 |
| Semiconductor device Grant 7,911,054 - Hasebe , et al. March 22, 2 | 2011-03-22 |
| Semiconductor package configuration with improved lead portion arrangement Grant 7,579,674 - Amano , et al. August 25, 2 | 2009-08-25 |
| Semiconductor Device App 20090189260 - HASEBE; Hajime ; et al. | 2009-07-30 |
| Method Of Manufacturing A Semiconductor Device App 20090176335 - Amano; Kenji ; et al. | 2009-07-09 |
| Semiconductor device Grant 7,518,156 - Hasebe , et al. April 14, 2 | 2009-04-14 |
| Method of manufacturing a semiconductor device Grant 7,514,293 - Amano , et al. April 7, 2 | 2009-04-07 |
| Semiconductor Device And Manufacturing Method Of The Same App 20090079051 - AMANO; Kenji ; et al. | 2009-03-26 |
| Method Of Manuacturing A Semiconductor Device App 20080305586 - Amano; Kenji ; et al. | 2008-12-11 |
| Method Of Manufacturing A Semiconductor Device App 20080268576 - Fukaya; Syuudai ; et al. | 2008-10-30 |
| Method of manufacturing a semiconductor device Grant 7,429,500 - Amano , et al. September 30, 2 | 2008-09-30 |
| Semiconductor Package Configuration With Improved Lead Portion Arrangement App 20080211069 - AMANO; Kenji ; et al. | 2008-09-04 |
| Method of manufacturing a semiconductor device Grant 7,410,834 - Fukaya , et al. August 12, 2 | 2008-08-12 |
| Semiconductor device and method of manufacturing thereof Grant 7,348,659 - Amano , et al. March 25, 2 | 2008-03-25 |
| Semiconductor Device And Method Of Manufacturing The Same App 20080067643 - TANAKA; Shigeki ; et al. | 2008-03-20 |
| Method of manufacturing a semiconductor device App 20060240599 - Amano; Kenji ; et al. | 2006-10-26 |
| Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section Grant 6,924,548 - Hasebe , et al. August 2, 2 | 2005-08-02 |
| Method of manufacturing a semiconductor device App 20050139982 - Fukaya, Syuudai ; et al. | 2005-06-30 |
| Semiconductor device and method of manufacturing thereof App 20050029640 - Amano, Kenji ; et al. | 2005-02-10 |
| Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin Grant 6,713,849 - Hasebe , et al. March 30, 2 | 2004-03-30 |
| Semiconductor device App 20040056337 - Hasebe, Hajime ; et al. | 2004-03-25 |
| Semiconductor device and its manufacturing method App 20040046240 - Hasebe, Hajime ; et al. | 2004-03-11 |
| Semiconductor device App 20020084518 - Hasebe, Hajime ; et al. | 2002-07-04 |
| Semiconductor device and method of producing the same Grant 5,304,844 - Horiuchi , et al. * April 19, 1 | 1994-04-19 |
| Semiconductor device and method of producing the same Grant 5,032,895 - Horiuchi , et al. July 16, 1 | 1991-07-16 |
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