Hase; Yukitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hase; Yukitoshi.The latest application filed is for "substrate transfer method and substrate transfer apparatus".

Company Profile

0.10.19

Hase; Yukitoshi - Kameyama N/A JP
Hase; Yukitoshi - Kameyama-shi JP
Hase; Yukitoshi - Mie-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor wafer transport method and semiconductor wafer transport apparatus Grant 8,960,266 - Yamamoto , et al. February 24, 2	2015-02-24
Adhesive tape joining method and adhesive tape joining apparatus Grant 8,349,106 - Miyamoto , et al. January 8, 2	2013-01-08
Substrate Transfer Method And Substrate Transfer Apparatus App 20120247657 - Yamamoto; Masayuki ; et al.	2012-10-04
Semiconductor Wafer Transport Method And Semiconductor Wafer Transport Apparatus App 20120132412 - Yamamoto; Masayuki ; et al.	2012-05-31
Workpiece Transport Method And Workpiece Transport Apparatus App 20120082516 - Yamamoto; Masayuki ; et al.	2012-04-05
Method for cutting protective tape of semiconductor wafer and protective tape cutting device Grant 8,109,185 - Yamamoto , et al. February 7, 2	2012-02-07
Method and apparatus for separating protective tape from semiconductor wafer Grant 8,038,816 - Yamamoto , et al. October 18, 2	2011-10-18
Method And Apparatus For Separating Protective Tape App 20110073241 - Hase; Yukitoshi ; et al.	2011-03-31
Adhesive Tape Joining Method And Adhesive Tape Joining Apparatus App 20110056615 - Miyamoto; Saburo ; et al.	2011-03-10
Protective Tape Separating Method And Apparatus App 20110048630 - Hase; Yukitoshi ; et al.	2011-03-03
Adhesive Tape Joining Method And Adhesive Tape Joining Apparatus App 20110048609 - Miyamoto; Saburo ; et al.	2011-03-03
Method And Configuration For Reinforcing Plate Material App 20110045234 - Miyamoto; Saburo ; et al.	2011-02-24
Wafer Mounting Method And Wafer Mounting Apparatus App 20100300612 - Yamamoto; Masayuki ; et al.	2010-12-02
Method for laminating substrate and apparatus using the method Grant 7,811,899 - Yamamoto , et al. October 12, 2	2010-10-12
Method for joining adhesive tape Grant 7,807,004 - Yamamoto , et al. October 5, 2	2010-10-05
Method And Apparatus For Separating Protective Tape From Semiconductor Wafer App 20100147442 - Yamamoto; Masayuki ; et al.	2010-06-17
Cutter Blade Cleaning Method And Cutter Blade Cleaning Device, As Well As Adhesive Tape Joining Apparatus Including The Same App 20090272403 - Yamamoto; Masayuki ; et al.	2009-11-05
Cutter Blade Cleaning Method And Cutter Blade Cleaning Device, As Well As Adhesive Tape Joining Apparatus Including The Same App 20090205679 - Yamamoto; Masayuki ; et al.	2009-08-20
Method For Cutting Protective Tape Of Semiconductor Wafer And Protective Tape Cutting Device App 20090133551 - Yamamoto; Masayuki ; et al.	2009-05-28
Ultraviolet Irradiation Method And Apparatus Using The Same App 20090095418 - Yamamoto; Masayuki ; et al.	2009-04-16
Method For Joining Adhesive Tape And Apparatus Using The Method App 20080169056 - Yamamoto; Masayuki ; et al.	2008-07-17
Method for separating semiconductor wafer from supporting member, and apparatus using the same Grant 7,393,757 - Miyamoto , et al. July 1, 2	2008-07-01
Method For Laminating Substrate And Apparatus Using The Method App 20080138936 - YAMAMOTO; Masayuki ; et al.	2008-06-12
Method of separating semiconductor wafer, and separating apparatus using the same Grant 7,384,811 - Miyamoto , et al. June 10, 2	2008-06-10
Substrate joining apparatus Grant 7,078,316 - Miyamoto , et al. July 18, 2	2006-07-18
Method of separating semiconductor wafer, and separating apparatus using the same App 20050074952 - Miyamoto, Saburo ; et al.	2005-04-07
Method for separating semiconductor wafer from supporting member, and apparatus using the same App 20050032332 - Miyamoto, Saburo ; et al.	2005-02-10
Substrate joining method and apparatus App 20050014345 - Miyamoto, Saburo ; et al.	2005-01-20

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