Harvilchuck; Joseph M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harvilchuck; Joseph M..The latest application filed is for "process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby".

Company Profile

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Harvilchuck; Joseph M. - Billings NY
Harvilchuck; Joseph M. - Lagrangeville NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby Grant 5,403,650 - Baudrand , et al. April 4, 1	1995-04-04
Method and structure for repairing electrical lines Grant 5,153,408 - Handford , et al. October 6, 1	1992-10-06
Method and means for co-sintering ceramic/metal MLC substrates Grant 5,130,067 - Flaitz , et al. July 14, 1	1992-07-14
High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology Grant 5,052,481 - Horvath , et al. October 1, 1	1991-10-01
Method and apparatus for causing an open circuit in a conductive line Grant 4,962,294 - Beckham , et al. October 9, 1	1990-10-09
High melting point copper-gold-tin brazing alloy for chip carriers Grant 4,634,638 - Ainslie , et al. * January 6, 1	1987-01-06
Stripped gold plating process Grant 4,601,424 - Adwalpalker , et al. July 22, 1	1986-07-22
Reactive ion etching of aluminum Grant 3,994,793 - Harvilchuck , et al. November 30, 1	1976-11-30

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