Harvey; Paul Marlan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harvey; Paul Marlan.The latest application filed is for "multi-chip module system with removable socketed modules".

Company Profile

0.7.8

Harvey; Paul Marlan - Austin TX
Harvey, Paul Marlan - Auatin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip Module System With Removable Socketed Modules App 20120098116 - Casey; Jon Alfred ; et al.	2012-04-26
Method of ball grid array package construction with raised solder ball pads Grant 8,153,516 - Harvey April 10, 2	2012-04-10
Method of Ball Grid Array Package Construction with Raised Solder Ball Pads App 20100308460 - Harvey; Paul Marlan	2010-12-09
Ball grid array package construction with raised solder ball pads Grant 7,816,754 - Harvey October 19, 2	2010-10-19
Generating Worst Case Bit Patterns For Simultaneous Switching Noise (ssn) In Digital Systems App 20100017158 - Mandrekar; Rohan ; et al.	2010-01-21
Ball Grid Array Package Construction With Raised Solder Ball Pads App 20070228566 - Harvey; Paul Marlan	2007-10-04
Ball grid array package construction with raised solder ball pads Grant 7,253,510 - Harvey August 7, 2	2007-08-07
Impedane measurement of chip, package, and board power supply system using pseudo impulse response Grant 7,203,608 - Aikawa , et al. April 10, 2	2007-04-10
Flex-based IC package construction employing a balanced lamination Grant 6,876,088 - Harvey April 5, 2	2005-04-05
Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction Grant 6,867,121 - Harvey March 15, 2	2005-03-15
Chip interconnection method and apparatus App 20040201970 - Harvey, Paul Marlan ; et al.	2004-10-14
Method and apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction App 20040140560 - Harvey, Paul Marlan	2004-07-22
Flex-based ic package construction employing a balanced lamination App 20040140538 - Harvey, Paul Marlan	2004-07-22
Ball grid array package construction with raised solder ball pads App 20040141298 - Harvey, Paul Marlan	2004-07-22
Multi-layer circuit having a via matrix interlayer connection and method for fabricating the same Grant 6,153,508 - Harvey November 28, 2	2000-11-28

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