Harvey; Paul M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harvey; Paul M..The latest application filed is for "packaging for eight-socket one-hop smp topology".

Company Profile

0.16.17

Harvey; Paul M. - Austin TX
Harvey; Paul M - Austin TX US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging for eight-socket one-hop SMP topology Grant 9,456,506 - Colbert , et al. September 27, 2	2016-09-27
Packaging for Eight-Socket One-Hop SMP Topology App 20150271926 - Colbert; John L. ; et al.	2015-09-24
Packaging for Eight-Socket One-Hop SMP Topology App 20150177794 - Colbert; John L. ; et al.	2015-06-25
Reducing impedance discontinuity in packages Grant 8,791,372 - Harvey , et al. July 29, 2	2014-07-29
Noise suppressor for semiconductor packages Grant 8,631,706 - Gruendler , et al. January 21, 2	2014-01-21
Method and apparatus to reduce impedance discontinuity in packages Grant 8,440,917 - Harvey , et al. May 14, 2	2013-05-14
Method and Apparatus to Reduce Impedance Discontinuity in Packages App 20130075148 - Harvey; Paul M. ; et al.	2013-03-28
System to improve coreless package connections Grant 8,338,949 - Harvey , et al. December 25, 2	2012-12-25
System to improve coreless package connections Grant 8,222,739 - Harvey , et al. July 17, 2	2012-07-17
Integrated Circuit Packaging Including Auxiliary Circuitry App 20120175763 - HARVEY; PAUL M. ; et al.	2012-07-12
System To Improve Coreless Package Connections And Associated Methods App 20120138349 - Harvey; Paul M. ; et al.	2012-06-07
Noise Suppressor For Semiconductor Packages App 20120020042 - Gruendler; Nickolaus J. ; et al.	2012-01-26
System To Improve Coreless Package Connections And Associated Methods App 20110147044 - Harvey; Paul M. ; et al.	2011-06-23
Electrically optimized and structurally protected via structure for high speed signals Grant 7,911,049 - Harvey , et al. March 22, 2	2011-03-22
Electrically optimized and structurally protected via structure for high speed signals Grant 7,687,391 - Harvey , et al. March 30, 2	2010-03-30
Method And Apparatus For Signal Probe Contact With Circuit Board Vias App 20090302874 - Harvey; Paul M. ; et al.	2009-12-10
Method and Apparatus to Reduce Impedance Discontinuity in Packages App 20090126983 - Harvey; Paul M. ; et al.	2009-05-21
Systems and methods for reducing simultaneous switching noise in an integrated circuit Grant 7,492,570 - Hosomi , et al. February 17, 2	2009-02-17
Patterned Circuits and Method for Making Same App 20090008133 - Bullard; Jeffrey W. ; et al.	2009-01-08
Electrically Optimized and Structurally Protected Via Structure for High Speed Signals App 20080272862 - Harvey; Paul M. ; et al.	2008-11-06
Electronic package with integrated capacitor Grant 7,388,275 - Geissinger , et al. June 17, 2	2008-06-17
Electrically Optimized and Structurally Protected Via Structure for High Speed Signals App 20080073796 - Harvey; Paul M. ; et al.	2008-03-27
Systems and methods for reducing simultaneous switching noise in an integrated circuit App 20060231947 - Hosomi; Eiichi ; et al.	2006-10-19
Electronic Package With Integrated Capacitor App 20060203458 - Geissinger; John D. ; et al.	2006-09-14
Electronic package with integrated capacitor Grant 7,064,412 - Geissinger , et al. June 20, 2	2006-06-20
Electronic package with integrated capacitor App 20030015787 - Geissinger, John D. ; et al.	2003-01-23
Laminated integrated circuit package App 20010052647 - Plepys, Anthony R. ; et al.	2001-12-20
Fabrication process for flex circuit applications Grant 6,150,071 - Harvey , et al. November 21, 2	2000-11-21
Laminated integrated circuit package Grant 6,140,707 - Plepys , et al. October 31, 2	2000-10-31

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