Haruta; Ryo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haruta; Ryo.The latest application filed is for "semiconductor device and production method for semiconductor device".

Company Profile

0.14.12

Haruta; Ryo - Tokyo JP
Haruta; Ryo - Takasaki JP
Haruta; Ryo - Kodaira JP
Haruta; Ryo - Kokubunji JP
Haruta; Ryo - Fuchu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Production Method For Semiconductor Device App 20080122050 - Ikeda; Osamu ; et al.	2008-05-29
Semiconductor device and method of manufacturing same Grant 6,897,570 - Nakajima , et al. May 24, 2	2005-05-24
Method of manufacturing semiconductor package including forming a resin sealing member Grant 6,887,739 - Fujisawa , et al. May 3, 2	2005-05-03
Semiconductor device and lead frame therefor Grant 6,844,219 - Kitano , et al. January 18, 2	2005-01-18
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate Grant 6,764,878 - Fujisawa , et al. July 20, 2	2004-07-20
Method of manufacturing semiconductor device having resin sealing body Grant 6,759,279 - Fujisawa , et al. July 6, 2	2004-07-06
Method of manufacturing semiconductor device App 20040005733 - Fujisawa, Atsushi ; et al.	2004-01-08
Semiconductor device and method of manufacturing same App 20030230809 - Nakajima, Takashi ; et al.	2003-12-18
Semiconductor device and mounting board Grant 6,621,160 - Shibamoto , et al. September 16, 2	2003-09-16
Method of manufacturing semiconductor device App 20020192872 - Fujisawa, Atsushi ; et al.	2002-12-19
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate App 20020182776 - Fujisawa, Atsushi ; et al.	2002-12-05
Ball grid array type semiconductor package having a flexible substrate Grant 6,476,466 - Fujisawa , et al. November 5, 2	2002-11-05
Method of manufacturing a semiconductor device Grant 6,448,111 - Fujisawa , et al. September 10, 2	2002-09-10
Semiconductor device, manufacturing method thereof and mounting board App 20020105070 - Shibamoto, Masanori ; et al.	2002-08-08
Ball grid array type semiconductor package having a flexible substrate App 20020079579 - Fujisawa, Atsushi ; et al.	2002-06-27
Ball grid array type semiconductor package having a flexible substrate App 20020070462 - Fujisawa, Atsushi ; et al.	2002-06-13
Semiconductor device, manufacturing method thereof and mounting board Grant 6,404,049 - Shibamoto , et al. June 11, 2	2002-06-11
Semiconductor device, manufacturing method thereof and mounting board App 20020066955 - Shibamoto, Masanori ; et al.	2002-06-06
Semiconductor device App 20020056561 - Yaguchi, Akihiro ; et al.	2002-05-16
Semiconductor device Grant 6,340,793 - Yaguchi , et al. January 22, 2	2002-01-22
Semiconductor device and process for producing the same App 20010042906 - Nakamura, Hisao ; et al.	2001-11-22
Semiconductor device and its manufacturing method App 20010015489 - Fujisawa, Atsushi ; et al.	2001-08-23
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting Grant 6,232,650 - Fujisawa , et al. May 15, 2	2001-05-15
Process for manufacturing semiconductor devices Grant 5,336,638 - Suzuki , et al. August 9, 1	1994-08-09
Method of semiconductor surface measurment and an apparatus for realizing the same Grant 5,140,272 - Nishimatsu , et al. August 18, 1	1992-08-18
Three-dimensional semiconductor device with thin film monocrystalline member contacting substrate at a plurality of locations Grant 4,570,175 - Miyao , et al. February 11, 1	1986-02-11

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