Haruna; Yuusuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haruna; Yuusuke.The latest application filed is for "conductive adhesive sheet".

Company Profile

4.3.9

Haruna; Yuusuke - Kizugawa JP
HARUNA; Yuusuke - Kizugawa-shi Kyoto
HARUNA; Yuusuke - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shield printed wiring board and method of manufacturing shield printed wiring board Grant 11,457,527 - Haruna , et al. September 27, 2	2022-09-27
Conductive Adhesive Sheet App 20220220346 - HARUNA; Yuusuke ; et al.	2022-07-14
Ground Member and Shielded Printed Wiring Board App 20220061150 - AOYAGI; Yoshihiko ; et al.	2022-02-24
Shielded Printed Wiring Board, Method For Manufacturing Shielded Printed Wiring Board, And Connecting Member App 20220046788 - HARUNA; Yuusuke	2022-02-10
Shield Printed Wiring Board and Method of Manufacturing Shield Printed Wiring Board App 20220030699 - HARUNA; Yuusuke ; et al.	2022-01-27
Method for Manufacturing Shielded Printed Wiring Board and Shielded Printed Wiring Board App 20210410272 - YAMAUCHI; Sirou ; et al.	2021-12-30
Printed Wiring Board App 20210084751 - HARUNA; Yuusuke ; et al.	2021-03-18
Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board Grant 10,638,598 - Haruna , et al.	2020-04-28
Printed Wiring Board App 20190373716 - HARUNA; Yuusuke ; et al.	2019-12-05
Ground Member, Shielded Printed Circuit Board, and Method for Manufacturing Shielded Printed Circuit Board App 20190261503 - HARUNA; Yuusuke ; et al.	2019-08-22
Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer Grant 10,159,142 - Haruna , et al. Dec	2018-12-18
Printed Wiring Board, Printed Wiring Board Reinforcing Member, And Printed Circuit Board App 20180103540 - HARUNA; Yuusuke ; et al.	2018-04-12

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