loadpatents
Patent applications and USPTO patent grants for Haruki; Tohru.The latest application filed is for "chemical mechanical polishing method and chemical mechanical polishing device".
Patent | Date |
---|---|
Method of manufacturing semiconductor device Grant 8,426,315 - Tochishita , et al. April 23, 2 | 2013-04-23 |
Chemical mechanical polishing method and chemical mechanical polishing device Grant 8,116,894 - Miyata , et al. February 14, 2 | 2012-02-14 |
Wafer, reticle, and exposure method using the wafer and reticle Grant 7,755,207 - Sogawa , et al. July 13, 2 | 2010-07-13 |
Chemical Mechanical Polishing Method And Chemical Mechanical Polishing Device App 20090170323 - MIYATA; MASANORI ;   et al. | 2009-07-02 |
Method of manufacturing semiconductor device App 20070072430 - Tochishita; Shouji ;   et al. | 2007-03-29 |
Wafer, reticle, and exposure method using the wafer and reticle App 20070023932 - Sogawa; Koichi ;   et al. | 2007-02-01 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.