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Patent applications and USPTO patent grants for Haruki; Masayoshi.The latest application filed is for "electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection apparatus".
Patent | Date |
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Electronic component thickness measurement method, method for manufacturing a series of electronic components using the measurement method, a series of electronic components manufactured by the manufacturing method, and electronic component inspection apparatus Grant 9,404,732 - Nishioka , et al. August 2, 2 | 2016-08-02 |
Electronic component Grant 9,136,056 - Haruki , et al. September 15, 2 | 2015-09-15 |
Electronic Component Thickness Measurement Method, Method For Manufacturing A Series Of Electronic Components Using The Measurement Method, A Series Of Electronic Components Manufactured By The Manufacturing Method, And Electronic Component Inspection Apparatus App 20150016071 - NISHIOKA; Yoshinao ;   et al. | 2015-01-15 |
Electronic component Grant 8,830,654 - Haruki , et al. September 9, 2 | 2014-09-09 |
Electronic Component App 20120236463 - HARUKI; Masayoshi ;   et al. | 2012-09-20 |
Electronic Component App 20120236462 - HARUKI; Masayoshi ;   et al. | 2012-09-20 |
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