| Patent | Date |
|---|
System and method for processor power delivery and thermal management
Grant 7,881,072 - Dibene, II , et al. February 1, 2 | 2011-02-01 |
System And Method For Processor Power Delivery And Thermal Management
App 20100325882 - DiBene, II; Joseph Ted ; et al. | 2010-12-30 |
System And Method For Processor Power Delivery And Thermal Management
App 20070268677 - DiBene; Joseph Ted II ; et al. | 2007-11-22 |
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
Grant 7,245,507 - DiBene, II , et al. July 17, 2 | 2007-07-17 |
System and method for processor power delivery and thermal management
App 20070004240 - Dibene; Joseph Ted II ; et al. | 2007-01-04 |
System and method for processor power delivery and thermal management
App 20050277310 - Dibene, Joseph Ted II ; et al. | 2005-12-15 |
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
Grant 6,947,293 - DiBene, II , et al. September 20, 2 | 2005-09-20 |
Ultra-low impedance power interconnection system for electronic packages
Grant 6,847,529 - Dibene, II , et al. January 25, 2 | 2005-01-25 |
Right-angle power interconnect electronic packaging assembly
Grant 6,845,013 - Hartke , et al. January 18, 2 | 2005-01-18 |
Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
Grant 6,741,480 - Hartke , et al. May 25, 2 | 2004-05-25 |
System and method for processor power delivery and thermal management
App 20030214800 - Dibene, Joseph Ted II ; et al. | 2003-11-20 |
Right-angle power interconnect electronic packaging assembly
App 20030181075 - Hartke, David H. ; et al. | 2003-09-25 |
Separable power delivery connector
Grant 6,623,279 - Derian , et al. September 23, 2 | 2003-09-23 |
Apparatus for delivering power to high performance electronic assemblies
Grant 6,618,268 - Dibene, II , et al. September 9, 2 | 2003-09-09 |
Method and apparatus for providing power to a microprocessor with intergrated thermal and EMI management
App 20030156400 - Dibene, Joseph Ted II ; et al. | 2003-08-21 |
Ultra-low impedance power interconnection system for electronic packages
Grant 6,556,455 - Dibene, II , et al. April 29, 2 | 2003-04-29 |
Integrated power delivery and cooling system for high power microprocessors
App 20030057548 - Hartke, David H. ; et al. | 2003-03-27 |
Ultra-low impedance power interconnection system for electronic packages
App 20030002268 - Dibene, Joseph Ted II ; et al. | 2003-01-02 |
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
App 20020196614 - DiBene, Joseph T. II ; et al. | 2002-12-26 |
Separable power delivery connector
App 20020176229 - Derian, Edward J. ; et al. | 2002-11-28 |
Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
App 20020172022 - DiBene, Joseph Ted II ; et al. | 2002-11-21 |
Integrated power delivery with flex circuit interconnection for high density high power circuits for integrated circuits and systems
App 20020164895 - Hartke, David H. ; et al. | 2002-11-07 |
Power interconnect method utilizing a flexible circuit between a voltage regulation module and an integrated circuit substrate
App 20020151195 - DiBene, Joseph Ted II ; et al. | 2002-10-17 |
Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
Grant 6,452,804 - Dibene, II , et al. September 17, 2 | 2002-09-17 |
Apparatus for providing power to a microprocessor with integrated thermal and EMI management
Grant 6,452,113 - Dibene, II , et al. September 17, 2 | 2002-09-17 |
Ultra-low impedance power interconnection system for electronic packages
App 20020114129 - Dibene, Joseph T. II ; et al. | 2002-08-22 |
Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
App 20020057554 - Dibene, Joseph T. II ; et al. | 2002-05-16 |
High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications
App 20020015288 - Dibene, Joseph T. II ; et al. | 2002-02-07 |
Inter-circuit encapsulated packaging
App 20020008963 - DiBene, II, Joseph T. ; et al. | 2002-01-24 |
Method and apparatus for delivering power to high performance electronic assemblies
App 20010036066 - Dibene, Joseph T. II ; et al. | 2001-11-01 |
Thermal/mechanical springbeam mechanism for heat transfer from heat source to heat dissipating device
App 20010033476 - Dibene, Joseph T. II ; et al. | 2001-10-25 |
Internal combustion engine
Grant 4,947,807 - Flaig , et al. August 14, 1 | 1990-08-14 |
Dynamically partitionable parallel processors
Grant 4,925,311 - Neches , et al. May 15, 1 | 1990-05-15 |
Multiprocessor intercommunication system and method
Grant 4,412,285 - Neches , et al. October 25, 1 | 1983-10-25 |
Interface for proximity coupled electro-optic devices
Grant 4,391,490 - Hartke July 5, 1 | 1983-07-05 |
Dielectric interface for proximity coupled electro-optic devices
Grant 4,370,029 - Sprague , et al. January 25, 1 | 1983-01-25 |
Analog-to-digital Converter
Grant 3,611,355 - Hartke October 5, 1 | 1971-10-05 |
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