Harries; Richard J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harries; Richard J..The latest application filed is for "flexible circuit interconnect structure and method of making same".

Company Profile

2.17.21

Harries; Richard J. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic package that includes lamination layer Grant 10,985,080 - Malatkar , et al. April 20, 2	2021-04-20
Flexible Circuit Interconnect Structure And Method Of Making Same App 20190043747 - MALATKAR; Pramod ; et al.	2019-02-07
Electronic Package That Includes Lamination Layer App 20180350709 - Malatkar; Pramod ; et al.	2018-12-06
Apparatuses and methods to enhance passivation and ILD reliability Grant 10,002,814 - Harries , et al. June 19, 2	2018-06-19
Thermal expansion compensators for controlling microelectronic package warpage Grant 9,793,225 - Malatkar , et al. October 17, 2	2017-10-17
Thermal Expansion Compensators For Controlling Microelectronic Package Warpage App 20160322311 - Malatkar; Pramod ; et al.	2016-11-03
Thermal expansion compensators for controlling microelectronic package warpage Grant 9,414,484 - Malatkar , et al. August 9, 2	2016-08-09
Interconnection designs and materials having improved strength and fatigue life Grant 9,136,239 - Sterrett , et al. September 15, 2	2015-09-15
Using collapse limiter structures between elements to reduce solder bump bridging Grant 8,941,236 - Limaye , et al. January 27, 2	2015-01-27
Interconnection Designs And Materials Having Improved Strength And Fatigue Life App 20140203430 - Sterrett; Terry Lee ; et al.	2014-07-24
Apparatuses And Methods To Enhance Passivation And Ild Reliability App 20140175643 - Harries; Richard J. ; et al.	2014-06-26
Using Collapse Limiter Structures Between Elements To Reduce Solder Bump Bridging App 20140091456 - LIMAYE; Ameya ; et al.	2014-04-03
Apparatuses and methods to enhance passivation and ILD reliability Grant 8,664,771 - Harries , et al. March 4, 2	2014-03-04
Interconnection designs and materials having improved strength and fatigue life Grant 8,642,462 - Sterrett , et al. February 4, 2	2014-02-04
Thermal Expansion Compensators For Controlling Microelectronic Package Warpage App 20130271929 - Malatkar; Pramod ; et al.	2013-10-17
Apparatuses And Methods To Enhance Passivation And Ild Reliability App 20120241952 - Harries; Richard J. ; et al.	2012-09-27
Apparatuses and methods to enhance passivation and ILD reliability Grant 8,198,185 - Harries , et al. June 12, 2	2012-06-12
First-level interconnects with slender columns, and processes of forming same App 20110122592 - Ganesan; Sanka ; et al.	2011-05-26
Embedded capacitors for reducing package cracking Grant 7,719,109 - Modi , et al. May 18, 2	2010-05-18
Apparatuses And Methods To Enhance Passivation And Ild Reliability App 20090325347 - Harries; Richard J. ; et al.	2009-12-31
Mold compound cap in a flip chip multi-matrix array package and process of making same Grant 7,514,300 - Lebonheur , et al. April 7, 2	2009-04-07
Packaged Integrated Circuit And Method Of Forming Thereof App 20090065931 - Rangaraj; Sudarshan V. ; et al.	2009-03-12
Interconnection Designs And Materials Having Improved Strength And Fatigue Life App 20080254611 - STERRETT; TERRY LEE ; et al.	2008-10-16
Interconnection designs and materials having improved strength and fatigue life Grant 7,387,827 - Sterrett , et al. June 17, 2	2008-06-17
Embedded capacitors for reducing package cracking App 20080096310 - Modi; Mitul ; et al.	2008-04-24
Mold compound cap in a flip chip multi-matrix array package and process of making same App 20080032459 - Lebonheur; Vassoudevane ; et al.	2008-02-07
Microelectronic assembly having a periphery seal around a thermal interface material App 20080001282 - Modi; Mitul ; et al.	2008-01-03
Mold compound cap in a flip chip multi-matrix array package and process of making same Grant 7,294,533 - Lebonheur , et al. November 13, 2	2007-11-13
Apparatuses and methods to enhance passivation and ILD reliability App 20070238222 - Harries; Richard J. ; et al.	2007-10-11
Mold compound cap in a flip chip multi-matrix array package and process of making same App 20040262776 - Lebonheur, Vassoudevane ; et al.	2004-12-30
Interconnection designs and materials having improved strength and fatigue life App 20040115409 - Sterrett, Terry Lee ; et al.	2004-06-17

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