Harney; Kieran P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Harney; Kieran P..The latest application filed is for "transducer with enlarged back volume".
Company Profile
1.32.35
- Harney; Kieran P. - Andover MA
- Harney; Kieran P. - Cambridge MA
Patent Activity
| Patent | Date |
|---|---|
| Transducer with enlarged back volume Grant 10,399,850 - Bolognia , et al. Sep | 2019-09-03 |
| Microphone module with sound pipe Grant 10,257,610 - Harney , et al. | 2019-04-09 |
| Including control data in a serial audio stream Grant 10,031,877 - Lewis , et al. July 24, 2 | 2018-07-24 |
| Transducer With Enlarged Back Volume App 20170334715 - Bolognia; David ; et al. | 2017-11-23 |
| Transducer with enlarged back volume Grant 9,738,515 - Bolognia , et al. August 22, 2 | 2017-08-22 |
| Microphone Module With Sound Pipe App 20170215001 - Harney; Kieran P. ; et al. | 2017-07-27 |
| MEMS microphone system for harsh environments Grant 9,681,242 - Harney , et al. June 13, 2 | 2017-06-13 |
| Microphone with built-in speaker driver Grant 9,544,673 - Lewis , et al. January 10, 2 | 2017-01-10 |
| Including Control Data In A Serial Audio Stream App 20160239451 - Lewis; Jerad M. ; et al. | 2016-08-18 |
| Microphone With Built-in Speaker Driver App 20160182987 - Lewis; Jerad M. ; et al. | 2016-06-23 |
| Multi-microphone system Grant 9,338,538 - Weigold , et al. May 10, 2 | 2016-05-10 |
| Microelectromechanical systems device optimized for flip-chip assembly and method of attaching the same Grant 9,282,389 - Khenkin , et al. March 8, 2 | 2016-03-08 |
| Microelectromechanical Systems Device Optimized For Flip-chip Assembly And Method Of Attaching The Same App 20160050475 - Khenkin; Aleksey S. ; et al. | 2016-02-18 |
| Microphone Module With Sound Pipe App 20160044409 - Harney; Kieran P. ; et al. | 2016-02-11 |
| Microphone module with sound pipe Grant 9,173,015 - Harney , et al. October 27, 2 | 2015-10-27 |
| Mems Microphone System For Harsh Environments App 20150304787 - Harney; Kieran P. ; et al. | 2015-10-22 |
| Microphone With Aligned Apertures App 20150271617 - Langlois; Eric ; et al. | 2015-09-24 |
| Microphone with aligned apertures Grant 9,078,068 - Langlois , et al. July 7, 2 | 2015-07-07 |
| Multiple microphone system Grant 9,002,036 - Harney , et al. April 7, 2 | 2015-04-07 |
| Noise mitigating microphone system and method Grant 8,995,693 - Harney , et al. March 31, 2 | 2015-03-31 |
| Packaged microphone with frame having die mounting concavity Grant 8,965,027 - Bolognia , et al. February 24, 2 | 2015-02-24 |
| Microphone Module With Sound Pipe App 20140294221 - Harney; Kieran P. ; et al. | 2014-10-02 |
| MEMS microphone system for harsh environments Grant 8,841,738 - Harney , et al. September 23, 2 | 2014-09-23 |
| Packaged Microphone with Frame Having Die Mounting Concavity App 20140233782 - Bolognia; David ; et al. | 2014-08-21 |
| Microphone module with sound pipe Grant 8,767,982 - Harney , et al. July 1, 2 | 2014-07-01 |
| MEMS Microphone System for Harsh Environments App 20140091406 - Harney; Kieran P. ; et al. | 2014-04-03 |
| Transducer with Enlarged Back Volume App 20140001580 - Bolognia; David ; et al. | 2014-01-02 |
| Multi-Microphone System App 20130236037 - Weigold; Jason W. ; et al. | 2013-09-12 |
| Multi-microphone system Grant 8,477,983 - Weigold , et al. July 2, 2 | 2013-07-02 |
| Microphone Module with Sound Pipe App 20130129136 - Harney; Kieran P. ; et al. | 2013-05-23 |
| Noise Mitigating Microphone System and Method App 20130101151 - Harney; Kieran P. ; et al. | 2013-04-25 |
| Noise mitigating microphone system and method Grant 8,351,632 - Harney , et al. January 8, 2 | 2013-01-08 |
| Multiple microphone system Grant 8,270,634 - Harney , et al. September 18, 2 | 2012-09-18 |
| Multiple Microphone System App 20120207324 - Harney; Kieran P. ; et al. | 2012-08-16 |
| Noise mitigating microphone system and method Grant 8,130,979 - Harney , et al. March 6, 2 | 2012-03-06 |
| Microphone with pressure relief Grant 8,111,871 - Zhang , et al. February 7, 2 | 2012-02-07 |
| Stacked MEMS device Grant 7,928,584 - O Suilleabhain , et al. April 19, 2 | 2011-04-19 |
| Noise Mitigating Microphone System and Method App 20100054495 - Harney; Kieran P. ; et al. | 2010-03-04 |
| Stacked MEMS Device App 20100032268 - Suilleabhain; Liam O. ; et al. | 2010-02-11 |
| Stacked MEMS device Grant 7,642,657 - Suilleabhain , et al. January 5, 2 | 2010-01-05 |
| Microphone with Aligned Apertures App 20080304681 - Langlois; Eric ; et al. | 2008-12-11 |
| Microphone with Pressure Relief App 20080175418 - Zhang; Xin ; et al. | 2008-07-24 |
| Microphone System with Silicon Microphone Secured to Package Lid App 20080175425 - Roberts; Carl M. ; et al. | 2008-07-24 |
| Leadframe With Different Topologies For Mems Package App 20080150104 - Zimmerman; Michael A. ; et al. | 2008-06-26 |
| Wafer level capped sensor Grant 7,357,017 - Felton , et al. April 15, 2 | 2008-04-15 |
| Multiple Microphone System App 20080049953 - Harney; Kieran P. ; et al. | 2008-02-28 |
| Wafer Level Capped Sensor App 20080009091 - Felton; Lawrence E. ; et al. | 2008-01-10 |
| Noise mitigating microphone system and method App 20070047744 - Harney; Kieran P. ; et al. | 2007-03-01 |
| Multi-Microphone System App 20070047746 - Weigold; Jason W. ; et al. | 2007-03-01 |
| Partially etched leadframe packages having different top and bottom topologies App 20070040231 - Harney; Kieran P. ; et al. | 2007-02-22 |
| Multi-surface mounting member and electronic device Grant 7,040,922 - Harney , et al. May 9, 2 | 2006-05-09 |
| Wafer level capped sensor App 20050262929 - Felton, Lawrence E. ; et al. | 2005-12-01 |
| Method and device for protecting micro electromechanical systems structures during dicing of a wafer Grant 6,946,326 - Spooner , et al. September 20, 2 | 2005-09-20 |
| MEMS device with conductive path through substrate Grant 6,936,918 - Harney , et al. August 30, 2 | 2005-08-30 |
| Fiber-attached optical devices with in-plane micromachined mirrors Grant 6,931,170 - Yun , et al. August 16, 2 | 2005-08-16 |
| Mems Device With Conductive Path Through Substrate App 20050127499 - Harney, Kieran P. ; et al. | 2005-06-16 |
| Wafer level capped sensor App 20050054133 - Felton, Lawrence E. ; et al. | 2005-03-10 |
| Multi-surface mounting member and electronic device App 20040244510 - Harney, Kieran P. ; et al. | 2004-12-09 |
| Fiber-attached optical devices with in-plane micromachined mirrors App 20040076366 - Yun, Chang-Han ; et al. | 2004-04-22 |
| Method and device for protecting micro electromechanical system structures during dicing of a wafer Grant 6,555,417 - Spooner , et al. April 29, 2 | 2003-04-29 |
| Method and device for protecting micro electromechanical systems structures during dicing of a wafer App 20020096743 - Spooner, Timothy R. ; et al. | 2002-07-25 |
| Method and device for protecting micro electromechanical systems structures during dicing of a wafer App 20020076873 - Spooner, Timothy R. ; et al. | 2002-06-20 |
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