loadpatents
name:-0.0080451965332031
name:-0.0058379173278809
name:-0.0011770725250244
Harmes; Michael C. Patent Filings

Harmes; Michael C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harmes; Michael C..The latest application filed is for "three-dimensional stacked substrate arrangements".

Company Profile
0.6.7
  • Harmes; Michael C. - North Plains OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Three-dimensional stacked substrate arrangements
Grant 8,421,225 - Ramanathan , et al. April 16, 2
2013-04-16
Three-dimensional Stacked Substrate Arrangements
App 20120280387 - Ramanathan; Shriram ;   et al.
2012-11-08
Three-dimensional stacked substrate arrangements
Grant 8,203,208 - Ramanathan , et al. June 19, 2
2012-06-19
Three-dimensional Stacked Substrate Arrangements
App 20110260319 - Ramanathan; Shriram ;   et al.
2011-10-27
Three-dimensional stacked substrate arrangements
Grant 7,973,407 - Ramanathan , et al. July 5, 2
2011-07-05
Three-dimensional stacked substrate arrangements
App 20090174070 - Ramanathan; Shriram ;   et al.
2009-07-09
Method and structure for interfacing electronic devices
Grant 7,348,217 - Kobrinsky , et al. March 25, 2
2008-03-25
Method and structure for interfacing electronic devices
App 20070015340 - Kobrinsky; Mauro J. ;   et al.
2007-01-18
Method and structure for interfacing electronic devices
App 20050184400 - Kobrinsky, Mauro J. ;   et al.
2005-08-25
Method and structure for interfacing electronic devices
Grant 6,870,270 - Kobrinsky , et al. March 22, 2
2005-03-22
Three-dimensional stacked substrate arrangements
App 20050003650 - Ramanathan, Shriram ;   et al.
2005-01-06
Method and structure for interfacing electronic devices
App 20040232537 - Kobrinsky, Mauro J. ;   et al.
2004-11-25

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