HARIRI; Haifa
Patent Applications and Registrations
Patent applications and USPTO patent grants for HARIRI; Haifa.The latest application filed is for "stepped coax mil pths for modulating inductance within a package".
- HARIRI; Haifa - Phoenix AZ
| Patent | Date |
|---|---|
| Stepped Coax Mil Pths For Modulating Inductance Within A Package App 20220102055 - MARIN; Brandon C. ; et al. | 2022-03-31 |
| Magnetic Core Inductors In Interposer App 20220093536 - BHARATH; Krishna ; et al. | 2022-03-24 |
| Thermally coupled package-on-package semiconductor packages Grant 11,222,877 - Karhade , et al. January 11, 2 | 2022-01-11 |
| Package Land Pad In Closed-loop Trace For High Speed Data Signaling App 20210305138 - ZHANG; Zhichao ; et al. | 2021-09-30 |
| In-plane Inductors In Ic Packages App 20210273036 - Marin; Brandon C. ; et al. | 2021-09-02 |
| Substrate Patch Reconstitution Options App 20200294920 - HARIRI; Haifa ; et al. | 2020-09-17 |
| Thermally Coupled Package-on-package Semiconductor App 20190103385 - KARHADE; OMKAR ; et al. | 2019-04-04 |
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