HARIRCHIAN; Tannaz

Patent Applications and Registrations

Patent applications and USPTO patent grants for HARIRCHIAN; Tannaz.The latest application filed is for "standoff members for semiconductor package".

Company Profile

3.4.9

HARIRCHIAN; Tannaz - Chandler AZ
HARIRCHIAN; Tannaz - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Standoff Members For Semiconductor Package App 20200066654 - CHANG; Je-Young ; et al.	2020-02-27
Thermally-optimized Tunable Stack In Cavity Package-on-package App 20200043894 - VAKANAS; George ; et al.	2020-02-06
Thermal management of molded packages Grant 10,424,559 - Eid , et al. Sept	2019-09-24
Standoff Members For Semiconductor Package App 20180190596 - Chang; Je-Young G. ; et al.	2018-07-05
Thermal Management of Molded Packages App 20180182736 - Eid; Feras ; et al.	2018-06-28
Energy Storage Material For Thermal Management And Associated Techniques And Configurations App 20180068926 - KRAJNIAK; JAN ; et al.	2018-03-08
Bumpless build-up layer package including an integrated heat spreader Grant 9,520,376 - Teh , et al. December 13, 2	2016-12-13
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20160027757 - Teh; Weng Hong ; et al.	2016-01-28
Bumpless build-up layer package including an integrated heat spreader Grant 9,153,552 - Teh , et al. October 6, 2	2015-10-06
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20150104907 - Teh; Weng Hong ; et al.	2015-04-16
Bumpless build-up layer package including an integrated heat spreader Grant 8,912,670 - Teh , et al. December 16, 2	2014-12-16
Bumpless Build-up Layer Package Including An Integrated Heat Spreader App 20140091445 - Teh; Weng Hong ; et al.	2014-04-03

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