Hareyama; Yukiya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hareyama; Yukiya.The latest application filed is for "electroconductive compound in flake form and electroconductive composition".
- Hareyama; Yukiya - Tokushima JP
- Hareyama, Yukiya - Tokushima-shi JP
| Patent | Date |
|---|---|
| Electroconductive compound in flake form and electroconductive composition Grant 7,288,217 - Hareyama , et al. October 30, 2 | 2007-10-30 |
| Electroconductive compound in flake form and electroconductive composition App 20060097230 - Hareyama; Yukiya ; et al. | 2006-05-11 |
| Printing sheets Grant 6,713,164 - Hareyama , et al. March 30, 2 | 2004-03-30 |
| Electroconductive plate-like titania and electroconductive composition Grant 6,703,438 - Hareyama March 9, 2 | 2004-03-09 |
| Carbon-coated porous silica powder, process for producing the same, and conductive resin composition containing the powder App 20030031856 - Hareyama, Yukiya ; et al. | 2003-02-13 |
| Electrically conductive resin composition App 20030010958 - Hareyama, Yukiya ; et al. | 2003-01-16 |
| Rubber composition Grant 6,479,582 - Hareyama , et al. November 12, 2 | 2002-11-12 |
| Electroconductive plate-like titania and electroconductive composition App 20020058141 - Hareyama, Yukiya | 2002-05-16 |
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