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name:-0.009026050567627
name:-0.0070798397064209
name:-0.00048995018005371
HARDEN; Brian Patent Filings

HARDEN; Brian

Patent Applications and Registrations

Patent applications and USPTO patent grants for HARDEN; Brian.The latest application filed is for "optical elements, method of replicating optical elements, particularly on a wafer level, and optical devices".

Company Profile
0.6.7
  • HARDEN; Brian - Charlotte NC US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Optical Elements, Method Of Replicating Optical Elements, Particularly On A Wafer Level, And Optical Devices
App 20130083397 - HARDEN; Brian ;   et al.
2013-04-04
Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
Grant 8,318,057 - Harden , et al. November 27, 2
2012-11-27
Integrated optical imaging systems including an interior space between opposing substrates and associated methods
Grant 8,153,957 - Feldman , et al. April 10, 2
2012-04-10
Integrated Camera And Associated Methods
App 20080136955 - KATHMAN; Alan D. ;   et al.
2008-06-12
Integrated Optical Systems And Associated Methods
App 20080111058 - FELDMAN; MICHAEL R. ;   et al.
2008-05-15
Wafer level integration of multiple optical elements
App 20070110361 - Harden; Brian ;   et al.
2007-05-17
Wafer level creation of multiple optical elements
Grant 6,844,978 - Harden , et al. January 18, 2
2005-01-18
Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
App 20040040648 - Harden, Brian ;   et al.
2004-03-04
Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
Grant 6,610,166 - Harden , et al. August 26, 2
2003-08-26
Wafer level creation of multiple optical elements
App 20030011889 - Harden, Brian ;   et al.
2003-01-16
Wafer level creation of multiple optical elements
Grant 6,406,583 - Harden , et al. June 18, 2
2002-06-18
Method of dicing wafer level integrated multiple optical elements
Grant 6,096,155 - Harden , et al. August 1, 2
2000-08-01

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