Haran; Bala

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haran; Bala.The latest application filed is for "cut inside replacement metal gate trench to mitigate n-p proximity effect".

Company Profile

10.6.8

Haran; Bala - Watervliet NY
Haran; Bala - Latham NY
Haran, Bala - Columbia SC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Short channel and long channel devices Grant 10,741,668 - Haran , et al. A	2020-08-11
Cut inside replacement metal gate trench to mitigate N-P proximity effect Grant 10,658,363 - Kannan , et al.	2020-05-19
Integrated circuit products with gate structures positioned above elevated isolation structures Grant 10,566,328 - Haran , et al. Feb	2020-02-18
Cut Inside Replacement Metal Gate Trench To Mitigate N-p Proximity Effect App 20190393221 - KANNAN; Balaji ; et al.	2019-12-26
Methods, apparatus, and manufacturing system for forming source and drain regions in a vertical field effect transistor Grant 10,461,173 - Jacob , et al. Oc	2019-10-29
Cut inside replacement metal gate trench to mitigate N-P proximity effect Grant 10,446,550 - Kannan , et al. Oc	2019-10-15
Methods Of Forming Gate Structures Above Elevated Isolation Structures App 20190267371 - Haran; Bala ; et al.	2019-08-29
Cut Inside Replacement Metal Gate Trench To Mitigate N-p Proximity Effect App 20190115346 - KANNAN; Balaji ; et al.	2019-04-18
Gate Stack Processes And Structures App 20190096679 - Kannan; Balaji ; et al.	2019-03-28
Replacement Metal Gate Module App 20190027578 - HARAN; Bala ; et al.	2019-01-24
Methods Of Forming An Air Gap Adjacent A Gate Structure Of A Finfet Device And The Resulting Devices App 20180366553 - Zang; Hui ; et al.	2018-12-20
Electrolytic and electroless process for treating metallic surfaces and products formed thereby App 20040217334 - Heimann, Robert L. ; et al.	2004-11-04
Electrolytic and electroless process for treating metallic surfaces and products formed thereby Grant 6,753,039 - Heimann , et al. June 22, 2	2004-06-22
Electrolytic and electroless process for treating metallic surfaces and products formed thereby App 20030034095 - Heimann, Robert L. ; et al.	2003-02-20

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