HARADA; Yusuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for HARADA; Yusuke.The latest application filed is for "semiconductor device and method for manufacturing the same".

Company Profile

3.15.14

HARADA; Yusuke - Kyoto-shi JP
Harada; Yusuke - Kyoto JP
Harada; Yusuke - Tokyo N/A JP
HARADA; Yusuke - Kobe-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And Method For Manufacturing The Same App 20210225755 - HARADA; Yusuke ; et al.	2021-07-22
Semiconductor device with internal and external electrode and method of manufacturing Grant 11,004,782 - Harada , et al. May 11, 2	2021-05-11
Semiconductor Device And Method For Manufacturing The Same App 20190287890 - HARADA; Yusuke ; et al.	2019-09-19
Electronic component having a heat dissipation member formed on a sealing member Grant 10,354,936 - Harada , et al. July 16, 2	2019-07-16
Electronic Component And Manufacturing Method Thereof App 20180019177 - HARADA; Yusuke ; et al.	2018-01-18
Semiconductor device having damascene interconnection structure that prevents void formation between interconnections having transparent dielectric substrate Grant 8,786,087 - Harada July 22, 2	2014-07-22
Motorcycle Tire App 20120312437 - HARADA; Yusuke	2012-12-13
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections Having Transparent Dielectric Substrate App 20100270675 - Harada; Yusuke	2010-10-28
Semiconductor device having damascene interconnection structure that prevents void formation between interconnections Grant 7,777,337 - Harada August 17, 2	2010-08-17
Semiconductor device Grant 7,176,577 - Harada February 13, 2	2007-02-13
Semiconductor device Grant 7,126,222 - Harada October 24, 2	2006-10-24
Method of manufacturing semiconductor device Grant 6,924,176 - Yoshie , et al. August 2, 2	2005-08-02
Semiconductor device App 20050110100 - Harada, Yusuke	2005-05-26
Semiconductor device App 20050098889 - Harada, Yusuke	2005-05-12
Method of forming a patterned tungsten damascene interconnect Grant 6,780,764 - Morita , et al. August 24, 2	2004-08-24
Method of forming CVD titanium film Grant 6,767,812 - Abe , et al. July 27, 2	2004-07-27
Semiconductor device having damascene interconnection structure that prevents void formation between interconnections Grant 6,759,747 - Harada July 6, 2	2004-07-06
Method of manufacturing a semiconductor device Grant 6,706,645 - Morita , et al. March 16, 2	2004-03-16
Semiconductor device having damascene interconnection structure that prevents void formation between interconnections App 20030183942 - Harada, Yusuke	2003-10-02
Method of forming a patterned tungsten damascene interconnect App 20030119303 - Morita, Tomoyuki ; et al.	2003-06-26
Method of manufacturing semiconductor device App 20030045087 - Yoshie, Toru ; et al.	2003-03-06
Method of manufacturing a semiconductor device App 20020192951 - Morita, Tomoyuki ; et al.	2002-12-19
Method of forming CVD titanium film App 20020192374 - Abe, Kazuhide ; et al.	2002-12-19
Semiconductor device having damascene interconnection structure that prevents void formation between interconnections App 20020125579 - Harada, Yusuke	2002-09-12
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections App 20020036346 - HARADA, YUSUKE	2002-03-28
Method of manufacturing semiconductor devices having multi-layered structure Grant 5,192,713 - Harada March 9, 1	1993-03-09
Method of forming a wiring pattern for a semiconductor device Grant 5,128,278 - Harada , et al. July 7, 1	1992-07-07
Making a semiconductor device with contact holes having different depths Grant 5,006,484 - Harada April 9, 1	1991-04-09

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