HARADA; Yasunori
Patent Applications and Registrations
Patent applications and USPTO patent grants for HARADA; Yasunori.The latest application filed is for "dielectric thin film element and electronic circuit device".
- HARADA; Yasunori - Tokyo JP
- Harada; Yasunori - Ube JP
- Harada, Yasunori - Ube-shi JP
| Patent | Date |
|---|---|
| Dielectric Thin Film Element And Electronic Circuit Device App 20220085147 - HARADA; Yasunori ; et al. | 2022-03-17 |
| Dielectric Film, Dielectric Thin Film, Electronic Component, Thin Film Capacitor, And Electronic Circuit Board App 20200312553 - OOTSUKI; Shirou ; et al. | 2020-10-01 |
| Dielectric film and dielectric element Grant 10,002,714 - Takeda , et al. June 19, 2 | 2018-06-19 |
| Dielectric Film And Dielectric Element App 20160329152 - TAKEDA; Saori ; et al. | 2016-11-10 |
| Method for shaping semisolid metals Grant 7,121,320 - Adachi , et al. October 17, 2 | 2006-10-17 |
| Method for shaping semisolid metals App 20050161127 - Adachi, Mitsuru ; et al. | 2005-07-28 |
| Method and apparatus for shaping semisolid metals Grant 6,851,466 - Adachi , et al. February 8, 2 | 2005-02-08 |
| Method and apparatus for shaping semisolid metals App 20040238150 - Adachi, Mitsuru ; et al. | 2004-12-02 |
| Method of shaping semisolid metals Grant 6,769,473 - Adachi , et al. August 3, 2 | 2004-08-03 |
| Apparatus for producing metal to be semimolten-molded Grant 6,165,411 - Adachi , et al. December 26, 2 | 2000-12-26 |
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