HARADA; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for HARADA; Shinji.The latest application filed is for "zirconia sintered body".

Company Profile

0.7.12

HARADA; Shinji - Aichi JP
Harada; Shinji - Osaka N/A JP
Harada; Shinji - Sakai-shi JP
Harada; Shinji - Gifu JP
Harada; Shinji - Katano-shi JP
Harada; Shinji - Katano JP
Harada, Shinji - Gifu-shi JP
Harada, Shinji - Chiba JP
Harada, Shinji - Fukuoka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Zirconia Sintered Body App 20220047364 - HARADA; Shinji ; et al.	2022-02-17
Acoustic wave device having an inorganic insulator and an organic insulator Grant 9,099,981 - Furukawa , et al. August 4, 2	2015-08-04
Acoustic Wave Device App 20120279795 - Furukawa; Mitsuhiro ; et al.	2012-11-08
Channel Switching System App 20100101660 - Kitamura; Ken ; et al.	2010-04-29
Multilayer module and method of manufacturing the same Grant 7,532,485 - Kimura , et al. May 12, 2	2009-05-12
Laminated Circuit Board And Its Manufacturing Method, And Manufacturing Method For Module Using The Laminated Circuit Board And Its Manufacturing Apparatus App 20080073024 - Kimura; Junichi ; et al.	2008-03-27
Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus Grant 7,317,621 - Kimura , et al. January 8, 2	2008-01-08
Multilayer module and method of manufacturing the same App 20060261472 - Kimura; Junichi ; et al.	2006-11-23
Solid scanning optical writing device App 20060181604 - Miyagawa; Yuta ; et al.	2006-08-17
Image forming apparatus, image forming method and program thereof App 20060055983 - Suzuki; Atsushi ; et al.	2006-03-16
Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein App 20050233122 - Nishimura, Mikio ; et al.	2005-10-20
Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus App 20050117312 - Kimura, Junichi ; et al.	2005-06-02
Antenna and electronic apparatus using it App 20040239564 - Sakae, Misako ; et al.	2004-12-02
Optical fiber resin coating apparatus and optical fiber resin coating method App 20030026919 - Kojima, Hidekazu ; et al.	2003-02-06
Robot vehicle for working on hot line App 20010055525 - Inokuchi, Hirofumi ; et al.	2001-12-27
Robot vehicle for hot-line job Grant 6,325,749 - Inokuchi , et al. December 4, 2	2001-12-04
Coiled component and its production method Grant 6,169,470 - Ibata , et al. January 2, 2	2001-01-02
Large-sized liquid crystal display Grant 4,874,227 - Matsukawa , et al. October 17, 1	1989-10-17

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