Harada; Seiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Harada; Seiki.The latest application filed is for "low-fat oil-fried food".

Company Profile

0.18.3

Harada; Seiki - Zushi JP
Harada, Seiki - Zushi-shi JP
Harada; Seiki - Hachioji JP
Harada; Seiki - Kanagawa-ken JP
Harada; Seiki - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microwave heatable bread-based fast food Grant 6,881,431 - Kawase , et al. April 19, 2	2005-04-19
Low-fat oil-fried food App 20040137130 - Watanabe, Yoshiaki ; et al.	2004-07-15
Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate Grant 6,747,339 - Mukai , et al. June 8, 2	2004-06-08
Microwave heatable bread-based fast food App 20040028790 - Kawase, Katsunori ; et al.	2004-02-12
Microwave heatable bread-based fast food Grant 6,623,777 - Kawase , et al. September 23, 2	2003-09-23
Microwave heatable bread-based fast food App 20020136815 - Kawase, Katsunori ; et al.	2002-09-26
Sustained release capsule and method for preparing the same Grant 6,030,641 - Yamashita , et al. February 29, 2	2000-02-29
Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate Grant 5,391,915 - Mukai , et al. * February 21, 1	1995-02-21
Low calorie processed food made with gel-particles of glucomannan coagulum Grant 5,213,834 - Ikeda , et al. May 25, 1	1993-05-25
Glucomannan product and a method to coagulate it Grant 5,049,401 - Harada , et al. September 17, 1	1991-09-17
Selective etching method of polyimide type resin film Grant 4,436,583 - Saiki , et al. March 13, 1	1984-03-13
Sputtering apparatus Grant 4,394,245 - Homma , et al. July 19, 1	1983-07-19
Semiconductor device with high density low temperature deposited Si.sub.w N.sub.x H.sub.y O.sub.z passivating layer Grant 4,365,264 - Mukai , et al. December 21, 1	1982-12-21
Method for fabricating semiconductor device and etchant for polymer resin Grant 4,218,283 - Saiki , et al. August 19, 1	1980-08-19
Method of forming an interconnection Grant 4,208,257 - Hom-ma , et al. June 17, 1	1980-06-17
Method for fabricating semiconductor device and etchant for polymer resin Grant 4,113,550 - Saiki , et al. September 12, 1	1978-09-12
Aluminum oxide layer bonding polymer resin layer to semiconductor device Grant 4,040,083 - Saiki , et al. August 2, 1	1977-08-02
Discrete semiconductor device having polymer resin as insulator and method for making the same Grant 4,017,886 - Tomono , et al. April 12, 1	1977-04-12
Isolating protective film for semiconductor devices and method for making the same Grant 4,001,870 - Saiki , et al. January 4, 1	1977-01-04
Multilayer wiring structure of integrated circuit and method of producing the same Grant 3,890,636 - Harada , et al. June 17, 1	1975-06-17
Multilayer Interconnected Structure For Semiconductor Integrated Circuit And Process For Manufacturing The Same Grant 3,801,880 - Harada , et al. April 2, 1	1974-04-02

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