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Patent applications and USPTO patent grants for Hara; Yasuji.The latest application filed is for "flexible printed wiring board for chip-on-film".
Patent | Date |
---|---|
Flexible printed wiring board for chip-on flexibles Grant 6,984,456 - Okada , et al. January 10, 2 | 2006-01-10 |
Flexible printed wiring board for chip-on-film App 20040163842 - Okada, Kazuyuki ;   et al. | 2004-08-26 |
Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by the apparatus Grant 6,652,725 - Taniguchi , et al. November 25, 2 | 2003-11-25 |
Electrodeposition apparatus for producing electrodeposited copper foil and electrodeposited copper foil produced by use of the apparatus App 20010042686 - Taniguchi, Kazuko ;   et al. | 2001-11-22 |
High tensile strength electrodeposited copper foil Grant 6,194,056 - Sakai , et al. February 27, 2 | 2001-02-27 |
High tensile strength electrodeposited copper foil and process of electrodepositing thereof Grant 5,958,209 - Sakai , et al. September 28, 1 | 1999-09-28 |
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