Hara; Tomihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hara; Tomihiro.The latest application filed is for "electrical connecting method and electrically connected connection structure".

Company Profile

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Hara; Tomihiro - Tokyo JP
Hara, Tomihiro - Kanagawa JP
Hara, Tomihiro - Kanagawa pref JP
Hara; Tomihiro - Yokohama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical Connecting Method And Electrically Connected Connection Structure App 20110139500 - Hara; Tomihiro	2011-06-16
Method Of Connecting Circuit Boards And Connected Structure App 20110000700 - Sato; Yoshiaki ; et al.	2011-01-06
Adhesive Composition Comprising Polyhydroxyether And Organic Particles, And Method For Connecting Circuit Board Using The Same App 20090321015 - Kawate; Kohichiro ; et al.	2009-12-31
Film adhesive for sealing, film laminate for sealing and sealing method App 20040213973 - Hara, Tomihiro ; et al.	2004-10-28
Thermosetting adhesive film, and an adhesive structure based on the use thereof App 20040068061 - Kawate, Kohichiro ; et al.	2004-04-08
Thermosetting adhesive App 20040063804 - Takeda, Masaaki ; et al.	2004-04-01
Iron-zinc alloy electro-galvanized steel sheet having a plurality of iron-zinc alloy coatings Grant 4,543,300 - Hara , et al. September 24, 1	1985-09-24
Method of Fe-Zn alloy electroplating Grant 4,519,878 - Hara , et al. May 28, 1	1985-05-28
Multi-layer surface-treated steel plate having zinc-containing layer Grant 4,450,209 - Hara , et al. May 22, 1	1984-05-22
Composite coating steel sheets having good corrosion resistance paintability and corrosion resistance after paint coating Grant 4,411,964 - Hara , et al. October 25, 1	1983-10-25
Surface treated steel sheets for paint coating Grant 4,407,899 - Hara , et al. October 4, 1	1983-10-04

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