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Hara; Noriaki Patent Filings

Hara; Noriaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hara; Noriaki.The latest application filed is for "laminate-cutting method, cutting device, and laminate-cutting pedestal".

Company Profile
0.4.3
  • Hara; Noriaki - Osaka JP
  • Hara; Noriaki - Kanagawa-ken JP
  • Hara; Noriaki - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminate-cutting method, cutting device, and laminate-cutting pedestal
App 20060107811 - Tanaka; Yoshikazu ;   et al.
2006-05-25
Sputtering target material
Grant 6,875,324 - Hara , et al. April 5, 2
2005-04-05
Sputtering Target Material
App 20040079635 - Hara, Noriaki ;   et al.
2004-04-29
Sputtering target material
App 20020185373 - Hara, Noriaki ;   et al.
2002-12-12
Process of preparing carbon support coated with polyolefin and of preparing gas diffusion electrode employing said carbon support
Grant 5,776,539 - Watanabe , et al. July 7, 1
1998-07-07
Electrocatalyst for anode
Grant 5,225,391 - Stonehart , et al. July 6, 1
1993-07-06
Electrocatalyst
Grant 5,208,207 - Stonehart , et al. May 4, 1
1993-05-04

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