HANNEBAUER; Robert Steven

Patent Applications and Registrations

Patent applications and USPTO patent grants for HANNEBAUER; Robert Steven.The latest application filed is for "encoder and decoder circuits for the transmission of video media using spread spectrum direct sequence modulation".

Company Profile

2.4.7

HANNEBAUER; Robert Steven - Vancouver CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Encoder And Decoder Circuits For The Transmission Of Video Media Using Spread Spectrum Direct Sequence Modulation App 20220190872 - HANNEBAUER; Robert Steven	2022-06-16
Method Of Manufacturing Of Advanced Three-dimensional Semiconductor Structures And Structures Produced Therefrom App 20210057403 - HANNEBAUER; Robert Steven	2021-02-25
Media Interfaces Incorporating Adaptive Compression App 20200014419 - HANNEBAUER; Robert Steven ; et al.	2020-01-09
Method of fabricating silicon/dielectric multi-layer semiconductor structures using layer transfer technology and also a three-dimensional multi-layer semiconductor device and stacked layer type image sensor using the same method, and a method of manufacturing a three-dimensional multi-layer semicon Grant 7,977,145 - Hannebauer July 12, 2	2011-07-12
Image sensor photodiodes using a multi-layer substrate and contact method and structure thereof Grant 7,977,718 - Hannebauer July 12, 2	2011-07-12
Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereof Grant 7,943,409 - Hannebauer May 17, 2	2011-05-17
Method Of Fabricating Image Sensor Photodiodes Using A Multi-layer Substrate And Contact Method And The Structure Thereof App 20100323468 - Hannebauer; Robert Steven	2010-12-23
Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereof Grant 7,838,318 - Hannebauer November 23, 2	2010-11-23
Image Sensor Photodiodes Using A Multi-layer Substrate And Contact Method And Structure Thereof App 20100109117 - Hannebauer; Robert Steven	2010-05-06
Method Of Fabricating Image Sensor Photodiodes Using A Multi-layer Substrate And Contact Method And The Structure Thereof App 20080185674 - Hannebauer; Robert Steven	2008-08-07
Method Of Fabricating Silicon/dielectric Multi-layer Semiconductor Structures Using Layer Transfer Technology And Also A Three-dimensional Multi-layer Semiconductor Device And Stacked Layer Type Image Sensor Using The Same Method, And A Method Of Manufacturing A Three-dimensional Multi-layer Semicon App 20080160723 - Hannebauer; Robert Steven	2008-07-03

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