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Patent applications and USPTO patent grants for Hanicinec; Martin.The latest application filed is for "semiconductor wafer dicing process".
Patent | Date |
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Semiconductor Wafer Dicing Process App 20210175122 - Hanicinec; Martin ;   et al. | 2021-06-10 |
Methods of plasma etching and plasma dicing Grant 10,872,775 - Ansell , et al. December 22, 2 | 2020-12-22 |
Methods Of Plasma Etching And Plasma Dicing App 20180350615 - ANSELL; Oliver J. ;   et al. | 2018-12-06 |
Method for reducing or removing organic and inorganic contamination from a vacuum system of imaging and analytical devices and a device for carrying it out Grant 9,782,805 - Stahel , et al. October 10, 2 | 2017-10-10 |
Raman microscope and electron microscope analytical system App 20150279616 - Jiruse; Jaroslav ;   et al. | 2015-10-01 |
Method For Reducing Or Removing Organic And Inorganic Contamination From A Vacuum System Of Imaging And Analytical Devices And A Device For Carrying It Out App 20150209841 - STAHEL; Pavel ;   et al. | 2015-07-30 |
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