Haney; Sarah

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haney; Sarah.The latest application filed is for "stress mitigation structure".

Company Profile

3.11.18

Haney; Sarah - San Jose CA
Haney; Sarah - Cary NC
Haney; Sarah - Apex NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stress Mitigation Structure App 20220165685 - Choi; YongIk ; et al.	2022-05-26
Stress mitigation structure Grant 11,276,650 - Choi , et al. March 15, 2	2022-03-15
Stress Mitigation Structure App 20210134735 - Choi; YongIk ; et al.	2021-05-06
Printed circuit board with cavity Grant 10,827,617 - Zhang , et al. November 3, 2	2020-11-03
Printed Circuit Board With Cavity App 20200245465 - Kind Code	2020-07-30
Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module Grant 10,271,421 - Gebauer , et al.	2019-04-23
Via structures for thermal dissipation Grant 9,997,428 - Maple , et al. June 12, 2	2018-06-12
Module with external shield and back-spill barrier for protecting contact pads Grant 9,974,181 - Haney , et al. May 15, 2	2018-05-15
Systems And Methods For Providing Electromagnetic Interference (emi) Shielding Between Inductors Of A Radio Frequency (rf) Module App 20180098417 - Gebauer; Bernhard ; et al.	2018-04-05
Magnet placement for integrated sensor packages Grant 9,791,470 - Eid , et al. October 17, 2	2017-10-17
Module With External Shield And Back-spill Barrier For Protecting Contact Pads App 20170280561 - Haney; Sarah ; et al.	2017-09-28
Printed Circuit Board With Compartmental Shields For Electronic Components And Methods Of Fabricating The Same App 20170223839 - Jain; Padam ; et al.	2017-08-03
Coreless Substrate Having Primer Layers Adjacent To Bottom And Top Outer Metal Layers App 20170215278 - Jain; Padam ; et al.	2017-07-27
Via Structures For Thermal Dissipation App 20170018501 - Maple; Marshall ; et al.	2017-01-19
Via Structures For Thermal Dissipation App 20170018478 - Maple; Marshall ; et al.	2017-01-19
Integration of pressure sensors into integrated circuit fabrication and packaging Grant 9,501,068 - Lee , et al. November 22, 2	2016-11-22
Integration Of Pressure Sensors Into Integrated Circuit Fabrication And Packaging App 20160161957 - LEE; KYU OH ; et al.	2016-06-09
Magnetic field shielding for packaging build-up architectures Grant 9,345,184 - Oster , et al. May 17, 2	2016-05-17
Integration of pressure or inertial sensors into integrated circuit fabrication and packaging Grant 9,260,294 - Lee , et al. February 16, 2	2016-02-16
In-package Temperature Sensor And Methods Therefor App 20150355035 - Eid; Feras ; et al.	2015-12-10
Printed Circuit Board Comprising Co-planar Surface Pads And Insulating Dielectric App 20150351229 - Lee; Lea-Teng ; et al.	2015-12-03
Integration Of Pressure Or Inertial Sensors Into Integrated Circuit Fabrication And Packaging App 20150183635 - Lee; Kyu Oh ; et al.	2015-07-02
Magnet Placement For Integrated Sensor Packages App 20150185247 - Eid; Feras ; et al.	2015-07-02
Magnetic Field Shielding For Packaging Build-up Architectures App 20150189797 - Oster; Sasha ; et al.	2015-07-02
Semiconductor transistor with P type re-grown channel layer Grant 7,795,691 - Zhang , et al. September 14, 2	2010-09-14
Semiconductor Transistor With P Type Re-grown Channel Layer App 20090189228 - ZHANG; QINGCHUN ; et al.	2009-07-30

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