Haneda; Hiroyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haneda; Hiroyuki.The latest application filed is for "setup support device".
- Haneda; Hiroyuki - Nagoya JP
- HANEDA; Hiroyuki - Nagoya-shi JP
- Haneda; Hiroyuki - Chiryu N/A JP
- Haneda; Hiroyuki - Chiryu-shi JP
- Haneda; Hiroyuki - Chita JP
- Haneda; Hiroyuki - Chita-shi JP
| Patent | Date |
|---|---|
| Setup support device Grant 10,772,251 - Hayashi , et al. Sep | 2020-09-08 |
| Setup Support Device App 20190281737 - HAYASHI; Hideki ; et al. | 2019-09-12 |
| Electronic-circuit assembling process Grant 9,204,586 - Kato , et al. December 1, 2 | 2015-12-01 |
| Component mounting apparatus Grant 8,584,350 - Kuroda , et al. November 19, 2 | 2013-11-19 |
| Component Mounting Apparatus App 20120020765 - KURODA; Hideya ; et al. | 2012-01-26 |
| Electronic-circuit Assembling Process And Electronic-circuit Assembling System App 20110302776 - KATO; Daisuke ; et al. | 2011-12-15 |
| Managing apparatus for managing assisting work to assist substrate-related-work performing system, and managing program for managing assisting work to assist substrate-related-work performing system Grant 7,245,978 - Kodama , et al. July 17, 2 | 2007-07-17 |
| Assisting work management apparatus for substrate work system and assisting work management program for substrate work system App 20060200264 - Kodama; Seigo ; et al. | 2006-09-07 |
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