Hando; Takuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hando; Takuya.The latest application filed is for "wiring board".
- Hando; Takuya - Nagoya JP
- HANDO; Takuya - Nagoya-shi JP
- Hando; Takuya - Inuyama JP
- HANDO; Takuya - Inuyama-shi JP
- Hando; Takuya - Aichi JP
| Patent | Date |
|---|---|
| Wiring board Grant 10,905,008 - Hayashi , et al. January 26, 2 | 2021-01-26 |
| Wiring Board App 20190373727 - HAYASHI; Takahiro ; et al. | 2019-12-05 |
| Method of manufacturing multi-layer wiring board Grant 9,237,656 - Maeda , et al. January 12, 2 | 2016-01-12 |
| Circuit Board, Manufacturing Method Therefor, And Pillar-shaped Terminal For Circuit Board App 20150364410 - HANDO; Takuya ; et al. | 2015-12-17 |
| Wiring Substrate And Method For Producing The Same App 20150366058 - HANDO; Takuya ; et al. | 2015-12-17 |
| Multilayer wiring board Grant 9,119,333 - Hando , et al. August 25, 2 | 2015-08-25 |
| Multilayer wiring board Grant 8,866,025 - Inoue , et al. October 21, 2 | 2014-10-21 |
| Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate App 20140202740 - MAEDA; Shinnosuke ; et al. | 2014-07-24 |
| Method of manufacturing multilayer wiring substrate Grant 8,707,554 - Maeda , et al. April 29, 2 | 2014-04-29 |
| Multilayered wiring substrate Grant 8,581,388 - Maeda , et al. November 12, 2 | 2013-11-12 |
| Method Of Manufacturing Multi-layer Wiring Board App 20130160290 - MAEDA; Shinnosuke ; et al. | 2013-06-27 |
| Multi-layer Wiring Substrate And Manufacturing Method Thereof App 20130161079 - MAEDA; Shinnosuke ; et al. | 2013-06-27 |
| Method Of Manufacturing Multilayer Wiring Substrate App 20130111746 - MAEDA; Shinnosuke ; et al. | 2013-05-09 |
| Multilayer Wiring Board App 20120211271 - HANDO; Takuya ; et al. | 2012-08-23 |
| Multilayer wiring substrate and method for manufacturing the same Grant 8,233,289 - Maeda , et al. July 31, 2 | 2012-07-31 |
| Multilayer Wiring Board App 20120186863 - INOUE; Masahiro ; et al. | 2012-07-26 |
| Wiring board having solder bump and method for manufacturing the same Grant 8,143,534 - Hando , et al. March 27, 2 | 2012-03-27 |
| Multilayer Wiring Substrate App 20110155438 - ITO; Tatsuya ; et al. | 2011-06-30 |
| Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate App 20110155443 - MAEDA; Shinnosuke ; et al. | 2011-06-30 |
| Multilayered Wiring Substrate App 20110156272 - MAEDA; Shinnosuke ; et al. | 2011-06-30 |
| Multilayer Wiring Substrate And Method For Manufacturing The Same App 20100208437 - MAEDA; Shinnosuke ; et al. | 2010-08-19 |
| Multilayer Wiring Substrate And Method For Manufacturing The Same App 20100132997 - HANDO; Takuya | 2010-06-03 |
| Solder Ball Mounting Apparatus And Wiring Board Manufacturing Method App 20090283574 - OKAZAKI; Ryuichi ; et al. | 2009-11-19 |
| Wiring Board Having Solder Bump And Method For Manufacturing The Same App 20090229861 - Hando; Takuya ; et al. | 2009-09-17 |
| Wiring substrate and stiffener therefor Grant 6,391,422 - Mori , et al. May 21, 2 | 2002-05-21 |
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