| Patent | Date |
|---|
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
Grant 10,141,217 - Takamoto , et al. Nov | 2018-11-27 |
Underfill material, laminated sheet and method for producing semiconductor device
Grant 10,014,235 - Takamoto , et al. July 3, 2 | 2018-07-03 |
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
Grant 9,679,797 - Takamoto , et al. June 13, 2 | 2017-06-13 |
Underfill Material, Laminated Sheet and Method for Producing Semiconductor Device
App 20170018472 - Takamoto; Naohide ; et al. | 2017-01-19 |
Semiconductor Device Manufacturing Method
App 20160240394 - Fukui; Akihiro ; et al. | 2016-08-18 |
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin Composition, and Dicing Tape-Integrated Sheet-Shaped Resin Composition
App 20160240523 - Takamoto; Naohide ; et al. | 2016-08-18 |
Semiconductor Device Manufacturing Method
App 20160233184 - Hanazono; Hiroyuki ; et al. | 2016-08-11 |
Opto-electric hybrid board
Grant 9,366,815 - Hanazono , et al. June 14, 2 | 2016-06-14 |
Thermosetting Resin Composition And Method For Producing A Semiconductor Device
App 20160075871 - Morita; Kosuke ; et al. | 2016-03-17 |
Printed circuit board and method of manufacturing the same
Grant 9,288,903 - Hasegawa , et al. March 15, 2 | 2016-03-15 |
Adhesive Film For Underfill, Adhesive Film For Underfill Integrated With Tape For Grinding Rear Surface, Adhesive Film For Underfill Integrated With Dicing Tape, And Semiconductor Device
App 20160040045 - Morita; Kosuke ; et al. | 2016-02-11 |
Underfill Film, Sealing Sheet, Method Of Manufacturing Semiconductor Device, And Semiconductor Device
App 20160035640 - MORITA; Kosuke ; et al. | 2016-02-04 |
Semiconductor Device Production Method, Sheet-shaped Resin Composition, Dicing Tape-integrated Sheet-shaped Resin Composition
App 20160013089 - Takamoto; Naohide ; et al. | 2016-01-14 |
Underfill Sheet, Underfill Sheet Integrated With Tape For Grinding Rear Surface, Underfill Sheet Integrated With Dicing Tape, And Method For Manufacturing Semiconductor Device
App 20150380277 - Morita; Kosuke ; et al. | 2015-12-31 |
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device
App 20150364357 - TAKAMOTO; Naohide ; et al. | 2015-12-17 |
Dicing-tape Integrated Film For Backside Of Semiconductor And Method Of Manufacturing Semiconductor Device
App 20150357223 - TAKAMOTO; Naohide ; et al. | 2015-12-10 |
Opto-electric hybrid board and method of manufacturing same
Grant 8,837,874 - Tsujita , et al. September 16, 2 | 2014-09-16 |
Printed circuit board and method of manufacturing the same
Grant 8,822,834 - Inoue , et al. September 2, 2 | 2014-09-02 |
Substance detection sensor
Grant 8,776,579 - Yamazaki , et al. July 15, 2 | 2014-07-15 |
Opto-electric hybrid board and method of manufacturing same
Grant 8,768,114 - Tsujita , et al. July 1, 2 | 2014-07-01 |
Paste composition and printed circuit board
Grant 8,642,686 - Inoue , et al. February 4, 2 | 2014-02-04 |
Opto-electric Hybrid Board
App 20140016896 - Hanazono; Hiroyuki ; et al. | 2014-01-16 |
Substance Detection Sensor
App 20130300441 - YAMAZAKI; Hiroshi ; et al. | 2013-11-14 |
Opto-electric Hybrid Board And Method Of Manufacturing Same
App 20130301980 - Tsujita; Yuichi ; et al. | 2013-11-14 |
Opto-electric Hybrid Board And Method Of Manufacturing Same
App 20130243370 - Tsujita; Yuichi ; et al. | 2013-09-19 |
Method for producing a sensor board
Grant 8,522,428 - Hanazono , et al. September 3, 2 | 2013-09-03 |
Substance detection sensor
Grant 8,511,142 - Yamazaki , et al. August 20, 2 | 2013-08-20 |
Method of manufacturing printed circuit board
Grant 8,438,726 - Inoue , et al. May 14, 2 | 2013-05-14 |
Paste Composition And Printed Circuit Board
App 20120061126 - INOUE; Shinichi ; et al. | 2012-03-15 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20120024581 - HASEGAWA; Mineyoshi ; et al. | 2012-02-02 |
Printed Circuit Board And Method Of Manufacturing The Same
App 20120024574 - INOUE; Shinichi ; et al. | 2012-02-02 |
Method Of Manufacturing Printed Circuit Board
App 20110277321 - INOUE; Shinichi ; et al. | 2011-11-17 |
Printed Circuit Board, Fuel Cell And Method Of Manufacturing Printed Circuit Board
App 20110281202 - HANAZONO; Hiroyuki ; et al. | 2011-11-17 |
Printed Circuit Board And Fuel Cell Including The Same
App 20110189508 - INOUE; Shinichi ; et al. | 2011-08-04 |
Dye-sensitized solar cell electrode and dye-sensitized solar cell
App 20110126900 - Inoue; Shinichi ; et al. | 2011-06-02 |
Dye-sensitized solar cell electrode and dye-sensitized solar cell
App 20110108106 - Hanazono; Hiroyuki ; et al. | 2011-05-12 |
Printed Circuit Board And Fuel Cell
App 20110111264 - HANAZONO; Hiroyuki | 2011-05-12 |
Printed Circuit Board And Fuel Cell
App 20110076522 - HANAZONO; Hiroyuki ; et al. | 2011-03-31 |
Dye-sensitized solar cell
App 20110048511 - Inoue; Shinichi ; et al. | 2011-03-03 |
Dye-sensitized solar cell electrode and dye-sensitized solar cell
App 20110023947 - Inoue; Shinichi ; et al. | 2011-02-03 |
Substance detection sensor
App 20100176827 - Yamazaki; Hiroshi ; et al. | 2010-07-15 |
Sensor board and producing method thereof
App 20100073886 - Hanazono; Hiroyuki ; et al. | 2010-03-25 |
Printed Circuit Board And Fuel Cell
App 20100047653 - YAMAZAKI; Hiroshi ; et al. | 2010-02-25 |
Printed Circuit Board And Manufacturing Method Thereof
App 20070272434 - HONJO; Mitsuru ; et al. | 2007-11-29 |
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