Hanafusa; Mikio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hanafusa; Mikio.The latest application filed is for "copper electrolytic solution and two-layer flexible substrate obtained using the same".

Company Profile

0.14.17

Hanafusa; Mikio - Ibaraki JP
Hanafusa; Mikio - Hitachi N/A JP
HANAFUSA; Mikio - Hitachi-shi JP
Hanafusa; Mikio - Toda JP
Hanafusa; Mikio - Sanda JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate Grant 8,470,450 - Hanafusa June 25, 2	2013-06-25
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 8,449,751 - Kumagai , et al. May 28, 2	2013-05-28
Copper Electrolytic Solution And Two-layer Flexible Substrate Obtained Using The Same App 20120189811 - HANAFUSA; Mikio	2012-07-26
Two-layer Flexible Substrate, And Copper Electrolytic Solution For Producing Same App 20110311834 - Hanafusa; Mikio	2011-12-22
Method Of Winding Up Copper Foil Or Copper Clad Laminate App 20110233320 - Hanafusa; Mikio	2011-09-29
Method of Producing Two-Layered Copper-Clad Laminate, and Two-Layered Copper-Clad Laminate App 20100279069 - Hanafusa; Mikio	2010-11-04
Copper electrolytic solution and electrolytic copper foil produced therewith App 20100270163 - Kumagai; Masashi ; et al.	2010-10-28
Copper electrolytic solution and electrolytic copper foil produced therewith Grant 7,777,078 - Kumagai , et al. August 17, 2	2010-08-17
Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same Grant 7,771,835 - Kumagai , et al. August 10, 2	2010-08-10
Electrolytic Copper Foil for Lithium Rechargeable Battery and Process for Producing the Copper Foil App 20100136434 - Hanafusa; Mikio	2010-06-03
Copper Electrolytic Solution And Two-layer Flexible Substrate Obtained Using The Same App 20100084275 - Hanafusa; Mikio	2010-04-08
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same Grant 7,678,257 - Kumagai , et al. March 16, 2	2010-03-16
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 7,378,160 - Kumagai , et al. May 27, 2	2008-05-27
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same App 20080073219 - Kumagai; Masashi ; et al.	2008-03-27
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20080075972 - Kumagai; Masashi ; et al.	2008-03-27
Copper foil having blackened surface or layer Grant 7,341,796 - Hanafusa March 11, 2	2008-03-11
Copper foil having blackened surface or layer App 20070141377 - Hanafusa; Mikio	2007-06-21
Copper electrolytic solution containing quaternary amine compound with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20070042201 - Kumagai; Masashi ; et al.	2007-02-22
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith Grant 7,144,491 - Kumagai , et al. December 5, 2	2006-12-05
Copper electrolytic solution and electrolytic copper foil produced therewith App 20060166032 - Kumagai; Masashi ; et al.	2006-07-27
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 7,005,055 - Kumagai , et al. February 28, 2	2006-02-28
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20060011488 - Kumagai; Masashi ; et al.	2006-01-19
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same App 20050252778 - Kumagai, Masashi ; et al.	2005-11-17
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith App 20050173256 - Kumagai, Masashi ; et al.	2005-08-11
Photoelectric conversion functional element and production method thereof Grant 6,791,257 - Sato , et al. September 14, 2	2004-09-14
Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same App 20040149583 - Kumagai, Masashi ; et al.	2004-08-05
Copper foil excellent in laser beam drilling performance and production method therefor Grant 6,638,642 - Kitano , et al. October 28, 2	2003-10-28
Copper foil excellent in laser beam drilling performance and production method therefor App 20030031888 - Kitano, Kouji ; et al.	2003-02-13
Medicinal composition containing pirprofen and cyclodextrin and a method of use Grant 4,565,807 - Uekama , et al. January 21, 1	1986-01-21

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