Han; Seung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Han; Seung.The latest application filed is for "semiconductor photoresist composition and method of forming patterns using the composition".

Company Profile

3.15.25

Han; Seung - Suwon-si KR
Han; Seung - San Ramon TX
HAN; Seung - Yongin-si KR
Han; Seung - Uiwang-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor photoresist composition, and method of forming patterns using the composition Grant 11,415,885 - Moon , et al. August 16, 2	2022-08-16
Semiconductor Photoresist Composition And Method Of Forming Patterns Using The Composition App 20220197138 - MOON; Kyungsoo ; et al.	2022-06-23
Photoresist Compositions App 20210380612 - Koh; Chawon ; et al.	2021-12-09
Semiconductor Photoresist Composition And Method Of Forming Patterns Using The Composition App 20210356861 - HAN; Seung ; et al.	2021-11-18
Semiconductor Photoresist Composition And Method Of Forming Patterns Using The Composition App 20210311387 - WOO; Changsoo ; et al.	2021-10-07
Systems And Processes For Improved Drag Reduction Estimation And Measurement App 20210198557 - NIZAMIDIN; NABIJAN ; et al.	2021-07-01
Semiconductor Photoresist Composition, And Method Of Forming Patterns Using The Composition App 20210109442 - MOON; Kyungsoo ; et al.	2021-04-15
Semiconductor Photoresist Composition And Method Of Forming Patterns Using The Composition App 20200348591 - KIM; Jaehyun ; et al.	2020-11-05
Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same Grant 10,047,191 - Cheon , et al. August 14, 2	2018-08-14
Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same Grant 9,957,348 - Lee , et al. May 1, 2	2018-05-01
Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same Grant 9,896,465 - Lee , et al. February 20, 2	2018-02-20
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same Grant 9,890,307 - Kwon , et al. February 13, 2	2018-02-13
Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same Grant 9,890,238 - Kim , et al. February 13, 2	2018-02-13
Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same Grant 9,870,971 - Chung , et al. January 16, 2	2018-01-16
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same Grant 9,850,390 - Cheon , et al. December 26, 2	2017-12-26
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same Grant 9,695,294 - Kim , et al. July 4, 2	2017-07-04
Phosphonium Compound, Epoxy Resin Composition Including The Same And Semiconductor Device Prepared Using The Same App 20170018473 - KWON; Ki Hyeok ; et al.	2017-01-19
Epoxy Resin Composition For Encapsulating A Semiconductor Device And Semiconductor Device Prepared Using The Same App 20170002192 - CHUNG; Joo Young ; et al.	2017-01-05
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Prepared Using The Same App 20160379909 - CHEON; Jin Min ; et al.	2016-12-29
Phosphonium Compound, Preparation Method Thereof, Epoxy Resin Composition Including The Same, And Semiconductor Device Prepared By Using The Same App 20160368937 - LEE; Dong Hwan ; et al.	2016-12-22
Pyridinium-based Compound, Epoxy Resin Composition Comprising Same, And Apparatus Manufactured Using Same App 20160333136 - LEE; Dong Hwan ; et al.	2016-11-17
Curing Catalyst For Epoxy Resin Composition, Epoxy Resin Composition Comprising Same, And Apparatus Manufactured By Using Same App 20160326303 - KIM; Jung Seob ; et al.	2016-11-10
Compound Containing Phosphonium Ion, Epoxy Resin Composition Containing Same, And Device Manufactured By Using Same App 20160159971 - CHEON; Jin Min ; et al.	2016-06-09
Epoxy resin composition and semiconductor apparatus prepared using the same Grant 9,153,513 - Na , et al. October 6, 2	2015-10-06
Epoxy Resin Composition And Semiconductor Apparatus Prepared Using The Same App 20150021763 - NA; Woo Chul ; et al.	2015-01-22
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same Grant 8,928,158 - Han , et al. January 6, 2	2015-01-06
Epoxy Resin Composition For Encapsulation Of Semiconductor Device And Semiconductor Device Encapsulated Using The Same App 20140179834 - HAN; Seung ; et al.	2014-06-26
Quaternary Phosphonium Salt, Epoxy Resin Composition For Encapsulating Semiconductor Device And Including The Quaternary Phosphonium Salt, And Semiconductor Device Encapsulated With The Epoxy Resin Composition App 20140179827 - KIM; Min Gyum ; et al.	2014-06-26
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Encapsulated Using The Same App 20140179835 - KIM; Min Gyum ; et al.	2014-06-26
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition Grant 8,531,044 - Han , et al. September 10, 2	2013-09-10
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Encapsulated With The Same App 20130158165 - HAN; Seung ; et al.	2013-06-20
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Encapsulated With The Same App 20120302667 - HAN; Seung ; et al.	2012-11-29
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Encapsulated With An Encapsulant Prepared From The Composition App 20120168969 - HAN; Seung ; et al.	2012-07-05

Company Registrations

NCAGE Code	1P70F	HAN SEUNG
CAGE Code	1P70F	HAN SEUNG

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