Han; Seong-Chan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Han; Seong-Chan.The latest application filed is for "underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor m".

Company Profile

4.24.34

Han; Seong-Chan - Cheonan-si KR
- Cheonan-si KR
Han; Seong-Chan - Chungcheongnam-do KR
Han; Seong Chan - Asan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Underfill solution supplying device for a dispenser, dispenser including the same, and method of manufacturing a semiconductor module using the same Grant 10,734,258 - Han , et al.	2020-08-04
Underfill Solution Supplying Device For A Dispenser, Dispenser Including The Same, And Method Of Manufacturing A Semiconductor M App 20190228996 - HAN; Seong-Chan ; et al.	2019-07-25
Method of manufacturing semiconductor package Grant 9,922,846 - Han , et al. March 20, 2	2018-03-20
Method Of Manufacturing Semiconductor Package App 20170103906 - Han; Seong-chan ; et al.	2017-04-13
Router apparatus Grant 9,056,377 - Yun , et al. June 16, 2	2015-06-16
Test socket for testing electrical characteristics of a memory module Grant 8,616,907 - Kim , et al. December 31, 2	2013-12-31
Test socket for testing electrical characteristics of a memory module Grant 08616907 -	2013-12-31
Semiconductor module socket apparatus Grant 8,587,946 - Lee , et al. November 19, 2	2013-11-19
Semiconductor module, socket for the same, and semiconductor module/socket assembly Grant 8,385,080 - Kim , et al. February 26, 2	2013-02-26
Router Apparatus App 20120207561 - YUN; Chan-Hyung ; et al.	2012-08-16
Semiconductor Module And System Including The Same App 20120182653 - LEE; Joo-Han ; et al.	2012-07-19
Reworkable passive element embedded printed circuit board Grant 8,218,330 - Bang , et al. July 10, 2	2012-07-10
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly Grant 8,189,342 - Bang , et al. May 29, 2	2012-05-29
Semiconductor packaging device Grant 8,148,828 - Shin , et al. April 3, 2	2012-04-03
Test Socket for Testing Electrical Characteristics of a Memory Module App 20120007625 - Kim; Jung-Hoon ; et al.	2012-01-12
Method of attaching a solder ball and method of repairing a memory module Grant 8,070,048 - Oh , et al. December 6, 2	2011-12-06
Semiconductor module Grant 8,053,889 - Han , et al. November 8, 2	2011-11-08
Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly App 20110216516 - Kim; Jung-hoon ; et al.	2011-09-08
Apparatus For Repairing Semiconductor Module App 20110168761 - Hwang; Sun-kyu ; et al.	2011-07-14
Semiconductor Module Socket Apparatus App 20110170264 - Lee; Joo-han ; et al.	2011-07-14
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module Grant 7,960,655 - Han , et al. June 14, 2	2011-06-14
Passive Device, Semiconductor Module, Electronic Circuit Board, And Electronic System Having The Passive Device, And Methods Of Fabricating And Inspecting The Semiconductor Module App 20110079872 - HAN; Seong-Chan ; et al.	2011-04-07
Method Of Attaching A Solder Ball And Method Of Repairing A Memory Module App 20110068151 - OH; Nam-Yong ; et al.	2011-03-24
Semiconductor device and method of manufacturing the same Grant 7,906,423 - Bang , et al. March 15, 2	2011-03-15
Semiconductor package having passive component and semiconductor memory module including the same Grant 7,902,664 - Bang , et al. March 8, 2	2011-03-08
Method of fabricating an electronic device Grant 7,900,349 - Han , et al. March 8, 2	2011-03-08
Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Grant 7,791,178 - Bang , et al. September 7, 2	2010-09-07
Method Of Manufacturing Semiconductor Module App 20100210042 - OH; Hyun-Jong ; et al.	2010-08-19
Semiconductor Packaging Device App 20100102427 - Shin; Dong-Woo ; et al.	2010-04-29
Semiconductor Device And Method Of Manufacturing The Same App 20100105201 - Bang; Hyo-Jae ; et al.	2010-04-29
Semiconductor device and method of manufacturing the same Grant 7,663,219 - Bang , et al. February 16, 2	2010-02-16
Method Of Electroless Plating App 20100015362 - LEE; Joo-Han ; et al.	2010-01-21
Semiconductor module App 20090310313 - HAN; Seong-chan ; et al.	2009-12-17
Semiconductor package and associated methods App 20090257209 - Han; Seong-Chan ; et al.	2009-10-15
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Grant 7,576,437 - Han , et al. August 18, 2	2009-08-18
Printed circuit board, method of manufacturing the printed circuit board, memory module having the printed circuit board and method of manufacturing the memory module App 20090056979 - Han; Seong-Chan ; et al.	2009-03-05
Reflow apparatuses and methods for reflow App 20090014503 - Choi; Jae-Hoon ; et al.	2009-01-15
Printed Circuit Board Capable Of Void Control During Surface Mounting Process App 20080164054 - SHIN; Dong-Woo ; et al.	2008-07-10
Chip Network Resistor Contacting Pcb Through Solder Balls And Semiconductor Module Having The Same App 20080136580 - BANG; Hyo-Jae ; et al.	2008-06-12
Electronic Device With Reworkable Electronic Component, Method Of Fabricating The Electronic Device And Method Of Reworking The Electronic Component App 20080130254 - HAN; Seong-Chan ; et al.	2008-06-05
Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same App 20080116546 - Bang; Hyo-Jae ; et al.	2008-05-22
Semiconductor device and method of manufacturing the same App 20080111235 - Bang; Hyo-Jae ; et al.	2008-05-15
Lead Frame Type Stack Package And Method O Fabricating The Same App 20080079128 - BANG; Hyo-Jae ; et al.	2008-04-03
Reworkable Passive Element Embedded Printed Circuit Board App 20080079118 - BANG; Hyo-jae ; et al.	2008-04-03
Mounting Structure Of Semiconductor Device Having Flux And Under Fill Resin Layer And Method Of Mounting Semiconductor Device App 20080042279 - BANG; Hyo-Jae ; et al.	2008-02-21
Semiconductor package and method of manufacturing the same App 20080044951 - Bang; Hyo-jae ; et al.	2008-02-21
Semiconductor package having passive component and semiconductor memory module including the same App 20080023812 - Bang; Hyo-jae ; et al.	2008-01-31
Apparatus for inspecting a semiconductor device App 20070189451 - Lee; Young-Soo ; et al.	2007-08-16
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same App 20070109758 - Han; Seong-Chan ; et al.	2007-05-17
Method of testing a substrate and apparatus for performing the same App 20070072467 - Lee; Young-Soo ; et al.	2007-03-29
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly App 20070047377 - Bang; Hyo-Jae ; et al.	2007-03-01
Component mounting apparatus including a demagnetizing device and method thereof App 20060283009 - Shin; Dong-Woo ; et al.	2006-12-21
Heat sink provided with coupling means, memory module attached with the heat sink and manufacturing method thereof Grant 6,449,156 - Han , et al. September 10, 2	2002-09-10
Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof App 20020039282 - Han, Seong-Chan ; et al.	2002-04-04
Apparatus for carrying plural printed circuit boards for semiconductor module Grant 5,927,504 - Han , et al. July 27, 1	1999-07-27

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