loadpatents
Patent applications and USPTO patent grants for Han; Sanguk.The latest application filed is for "chip-stacked semiconductor package and method of manufacturing same".
Patent | Date |
---|---|
Semiconductor package Grant 11,444,060 - Han , et al. September 13, 2 | 2022-09-13 |
Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20220262689 - KIM; Hyoeun ;   et al. | 2022-08-18 |
Chip-on-film Package And Display Apparatus Including The Same App 20220246530 - Jung; Jaemin ;   et al. | 2022-08-04 |
Semiconductor Package App 20220216186 - Han; Sanguk ;   et al. | 2022-07-07 |
Chip-stacked semiconductor package and method of manufacturing same Grant 11,328,966 - Kim , et al. May 10, 2 | 2022-05-10 |
Chip On Film Package And Display Apparatus Including The Same App 20220139799 - Jung; Jaemin ;   et al. | 2022-05-05 |
Semiconductor Package App 20210193581 - SEO; Sunkyoung ;   et al. | 2021-06-24 |
Semiconductor Package App 20210013181 - Han; Sanguk ;   et al. | 2021-01-14 |
Chip-stacked Semiconductor Package And Method Of Manufacturing Same App 20200411393 - Kim; Hyoeun ;   et al. | 2020-12-31 |
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