Han; Qingyuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Han; Qingyuan.The latest application filed is for "ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics".
- Han; Qingyuan - Columbia MD
- Han; Qingyuan - Midland MI
| Patent | Date |
|---|---|
| Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics Grant 7,629,272 - Waldfried , et al. December 8, 2 | 2009-12-08 |
| Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication Grant 7,078,161 - Waldfried , et al. July 18, 2 | 2006-07-18 |
| Fluorine-free plasma curing process for porous low-k materials Grant 7,011,868 - Waldfried , et al. March 14, 2 | 2006-03-14 |
| Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics App 20060024976 - Waldfried; Carlo ; et al. | 2006-02-02 |
| Plasma ashing process Grant 6,951,823 - Waldfried , et al. October 4, 2 | 2005-10-04 |
| Plasma curing process for porous low-k materials Grant 6,913,796 - Albano , et al. July 5, 2 | 2005-07-05 |
| Plasma ashing process for removing photoresist and residues during ferroelectric device fabrication App 20040157170 - Waldfried, Carlo ; et al. | 2004-08-12 |
| Plasma curing of MSQ-based porous low-k film materials Grant 6,759,098 - Han , et al. July 6, 2 | 2004-07-06 |
| High modulus, low dielectric constant coatings Grant 6,759,133 - Berry, III , et al. July 6, 2 | 2004-07-06 |
| Ultraviolet curing processes for advanced low-k materials Grant 6,756,085 - Waldfried , et al. June 29, 2 | 2004-06-29 |
| Plasma ashing process App 20040084412 - Waldfried, Carlo ; et al. | 2004-05-06 |
| Low temperature UV pretreating of porous low-k materials App 20040058090 - Waldfried, Carlo ; et al. | 2004-03-25 |
| Fluorine-free plasma curing process for porous low-k materials App 20040028916 - Waldfried, Carlo ; et al. | 2004-02-12 |
| Ultraviolet curing processes for advanced low-k materials App 20040018319 - Waldfried, Carlo ; et al. | 2004-01-29 |
| High modulus, low dielectric constant coatings App 20030203217 - Berry, Ivan Louis III ; et al. | 2003-10-30 |
| Plasma ashing process Grant 6,630,406 - Waldfried , et al. October 7, 2 | 2003-10-07 |
| Plasma curing process for porous silica thin film App 20030175535 - Berry, Ivan L. III ; et al. | 2003-09-18 |
| Fluorine-free plasma curing process for porous low-k materials App 20030157267 - Waldfried, Carlo ; et al. | 2003-08-21 |
| High modulus, low dielectric constant coatings Grant 6,576,300 - Berry, III , et al. June 10, 2 | 2003-06-10 |
| Plasma curing process for porous silica thin film Grant 6,558,755 - Berry, III , et al. May 6, 2 | 2003-05-06 |
| Plasma ashing process Grant 6,548,416 - Han , et al. April 15, 2 | 2003-04-15 |
| Ultraviolet curing process for porous low-K materials App 20030054115 - Albano, Ralph ; et al. | 2003-03-20 |
| Plasma ashing process App 20030032300 - Waldfried, Carlo ; et al. | 2003-02-13 |
| Plasma Ashing Process App 20030022511 - Han, Qingyuan ; et al. | 2003-01-30 |
| Plasma curing process for porous low-k materials App 20020106500 - Albano, Ralph ; et al. | 2002-08-08 |
| Plasma curing of MSQ-based porous low-k film materials App 20020102413 - Han, Qingyuan ; et al. | 2002-08-01 |
| Plasma curing process for porous silica thin film App 20010038919 - Berry, Ivan L. III ; et al. | 2001-11-08 |
| Oxygen free plasma stripping process Grant 6,281,135 - Han , et al. August 28, 2 | 2001-08-28 |
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