loadpatents
Patent applications and USPTO patent grants for Han; Pyung Hwa.The latest application filed is for "semiconductor package".
Patent | Date |
---|---|
Semiconductor package Grant 11,189,567 - Han , et al. November 30, 2 | 2021-11-30 |
Semiconductor package Grant 11,094,660 - Kim , et al. August 17, 2 | 2021-08-17 |
Semiconductor package having mark with identification information Grant 10,825,778 - Bae , et al. November 3, 2 | 2020-11-03 |
Semiconductor Package App 20200118959 - KIM; Jung Soo ;   et al. | 2020-04-16 |
Semiconductor Package App 20200111742 - HAN; Pyung Hwa ;   et al. | 2020-04-09 |
Semiconductor Package App 20200105679 - Bae; Sung Hawn ;   et al. | 2020-04-02 |
Fan-out semiconductor package Grant 10,515,916 - Byun , et al. Dec | 2019-12-24 |
Fan-out semiconductor package Grant 10,157,868 - Byun , et al. Dec | 2018-12-18 |
Fan-out Semiconductor Package App 20180308815 - Byun; Dae Jung ;   et al. | 2018-10-25 |
Fan-out Semiconductor Package App 20180061795 - BYUN; Dae Jung ;   et al. | 2018-03-01 |
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