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Patent applications and USPTO patent grants for Han; Lung-Tien.The latest application filed is for "integrated process modulation (ipm) a novel solution for gapfill with hdp-cvd".
Patent | Date |
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Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD Grant 7,524,750 - Nemani , et al. April 28, 2 | 2009-04-28 |
Integrated Process Modulation (ipm) A Novel Solution For Gapfill With Hdp-cvd App 20070243693 - Nemani; Srinivas D. ;   et al. | 2007-10-18 |
Low stress STI films and methods Grant 7,244,658 - Yieh , et al. July 17, 2 | 2007-07-17 |
Low stress STI films and methods App 20070087515 - Yieh; EllieY ;   et al. | 2007-04-19 |
High density plasma chemical vapor deposition (HDP-CVD) processing of gallium arsenide wafers App 20020076939 - Li, Zhuang ;   et al. | 2002-06-20 |
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